A three-axis vibration excitation device that can excite mems microstructure off-chip

Abstract

The invention discloses a three-axis vibration excitation device that can excite MEMS microstructures off-chip, including sleeves and bottom plates, piezoelectric ceramics, pressure sensors, upper and lower connecting blocks, steel balls, elastic supports and MEMS microstructures. Structure; there is an annular top plate on the upper end of the sleeve, and the microstructure is set on the annular top plate through elastic supports; there are guide shafts evenly distributed between the top and bottom plates, and the lower connecting blocks are uniformly distributed through the sleeve wall and set in the Guide arm on the guide shaft; spherical grooves and tapered grooves for holding steel balls are respectively arranged on the upper and lower connecting blocks, and tension springs are evenly distributed on the circumference between the upper and lower connecting blocks; piezoelectric ceramics It is sandwiched between the pressure sensor and the elastic support; locking devices are respectively provided on the guide arms. The device can apply different sizes of pre-tightening force to the piezoelectric ceramics, so that the obtained pre-tightening force measurement value is more accurate, and the adjustment process of compensating the parallelism error of the two working surfaces of the piezoelectric ceramics becomes smoother and smoother, which is convenient Test dynamic characteristic parameters.

Description

Technical field [0001] The invention belongs to the technical field of micro-mechanical electronic systems, and particularly relates to a three-axis vibration excitation device that can perform off-chip excitation of MEMS microstructures. Background technique [0002] Because MEMS micro-devices have the advantages of low cost, small size and light weight, they have broad application prospects in many fields such as automobiles, aerospace, information communication, biochemistry, medical treatment, automatic control, and national defense. For many MEMS devices, the small displacements and small deformations of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of the amplitude, natural frequency, damping ratio and other dynamic characteristics of these microstructures has become the development of MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, the...

AI Technical Summary

Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

Images