Thin-film AlGaInP light-emitting diode chip and its preparation method
A light-emitting diode, thin-film technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of light extraction efficiency of less than 10%, and achieve the effect of improving electro-optical conversion efficiency, improving identification, and reducing shading effects.
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[0036] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0037] image 3 As shown, a thin-film AlGaInP light-emitting diode chip includes: a bonding substrate 300 with front and back sides; from the front of the bonding substrate 300 upwards are: substrate side metal bonding layer 301, epitaxial material side metal bonding layer 302, the P-surface diffusion barrier metal layer 303 and the P-surface reflective ohmic contact layer 304, the P-surface reflective ohmic contact layer 304 is an Ag or Ni / Ag laminated structure, and forms a good ohmic contact with the P-type current spreading layer 305, and has Light reflection and ohmic contact function; from the P surface reflection ohmic contact layer 304, there are P-type current spreading layer 305, P-type confinement layer 306, P-side space layer 307, multi-quantum well light-emitting region 308, N-side space layer 309, N-type confinement layer 310 , N-type r...
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