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Amino-terminated polyether modified medium temperature curing epoxy glue film and preparation method thereof

A technology of amino-terminated polyether and epoxy glue, which is applied in the direction of epoxy resin glue, adhesive, film/sheet adhesive, etc., which can solve the problem that the medium temperature epoxy film cannot meet the heat resistance and good toughness at the same time and other issues to achieve good heat resistance

Active Publication Date: 2018-06-29
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the purposes of the present invention is to solve the problem that the medium-temperature epoxy film prepared by the existing modification method cannot satisfy both good heat resistance and good toughness, and to provide a modified medium-temperature curing method of amino-terminated polyether epoxy film

Method used

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  • Amino-terminated polyether modified medium temperature curing epoxy glue film and preparation method thereof
  • Amino-terminated polyether modified medium temperature curing epoxy glue film and preparation method thereof
  • Amino-terminated polyether modified medium temperature curing epoxy glue film and preparation method thereof

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specific Embodiment approach 1

[0022] Embodiment 1: This embodiment is a kind of amino-terminated polyether modified medium-temperature curing epoxy film, which consists of 30-50 parts by weight of bisphenol-type epoxy resin, 20-50 parts of amino-terminated polyether It is prepared by ether modified epoxy resin, 5-15 parts of auxiliary toughening agent, 5-15 parts of latent curing agent, 1-5 parts of curing accelerator and 0.5-3 parts of silane coupling agent.

specific Embodiment approach 2

[0023] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the bisphenol epoxy resin is bisphenol A epoxy resin or bisphenol F epoxy resin, wherein the bisphenol A epoxy resin The epoxy value is 0.2-0.58; the epoxy value of bisphenol F epoxy resin is 0.2-0.58. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0024] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is: the amino-terminated polyether modified epoxy resin and the auxiliary toughening agent, wherein the auxiliary toughening agent is core-shell rubber, polysulfone One or more of resin, solid nitrile rubber, epoxy nitrile rubber and carboxylated nitrile rubber are mixed in any ratio. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses an amino-terminated polyether modified medium temperature curing epoxy glue film, which is prepared from the following components: 30 to 50 parts of bisphenol type epoxy resin,20 to 50 parts of amino-terminated polyether modified epoxy resin, 5 to 15 parts of auxiliary toughening agent, 5 to 15 parts of latent curing agent, 1 to 5 parts of curing accelerator, and 0.5 to 3parts of silane coupling agent. The invention also discloses a method for preparing the amino-terminated polyether modified medium temperature curing epoxy glue film. The problem that the medium temperature epoxy glue film prepared by the existing modification method cannot satisfy both good heat resistance and good toughness can be well solved.

Description

technical field [0001] The invention relates to the field of epoxy adhesive films and preparation methods thereof, in particular to an amino-terminated polyether modified medium-temperature curing epoxy adhesive film and a preparation method thereof. Background technique [0002] Epoxy adhesive film has excellent structural bonding performance and durability, and has the characteristics of one-component easy operation and uniform glue application. It is widely used in the bonding of honeycomb sandwich structures such as aerospace, rail transit, and ships. With the development of civil aviation, rail transit, shipbuilding and construction fields, epoxy adhesive films are required to maintain their excellent heat resistance and flexibility while lowering the curing temperature. The current modification method on the market mainly uses nitrile rubber to increase the toughness of the epoxy film, but the heat resistance of the film decreases. Curing epoxy film is of great signif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/08C09J7/30
CPCC09J11/06C09J11/08C09J163/00C08L2205/025C08L2201/08C09J2463/00C08L63/00C08L81/06C08L9/02C08L15/00C08L13/00C08K5/544C08K5/5435C08K5/5425
Inventor 欧涛刘龙江栾猛唐雪清
Owner 康达新材料(集团)股份有限公司
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