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Production device of circuit board photocuring solder-resisting printing material

A technology of production equipment and plate light, which is applied in the direction of photosensitive materials, epoxy resin coatings, coatings, etc. for optical mechanical equipment, and can solve problems such as complex production equipment

Inactive Publication Date: 2018-07-03
CHENGDU MI ER DUN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing production devices are relatively complicated. The photo-curable solder resist printing material is used as the solder resist cured film of the circuit board. The pros and cons of the production device are of great economic significance for improving product quality and reducing the content of by-products.

Method used

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  • Production device of circuit board photocuring solder-resisting printing material

Examples

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Comparison scheme
Effect test

example 1

Appropriate amount

[0009] The production equipment of light-cured solder resist printing materials for circuit boards mainly includes: polymerization kettle (D101), storage tank (F101), pump (J101), kneader (L101), grinding machine (L102), among which, polymerization kettle (D101 ) are connected with the pump (J101) and the kneader (L101) respectively, and the kneader (L101) is connected with the polymerization kettle (D101) and the grinder (L102) respectively, wherein, the diameter of the outer pot of the polymerization kettle (D101) is 1600mm, and the storage Tank (F101) full volume 2.6m 3 , The diameter of the water inlet of the pump (J101) is 160mm.

[0010] The production device of photocurable solder resist printing materials for circuit boards. The production process is as follows: add epoxy resin, modified compound and acrylic acid to the polymerization kettle D101, and polymerize at 70°C for 2 hours to obtain photosensitive resin. Put the photosensitive resi...

example 2

Appropriate amount

[0015] The production equipment of light-cured solder resist printing materials for circuit boards mainly includes: polymerization kettle (D101), storage tank (F101), pump (J101), kneader (L101), grinding machine (L102), among which, polymerization kettle (D101 ) are connected with the pump (J101) and the kneader (L101) respectively, and the kneader (L101) is connected with the polymerization kettle (D101) and the grinder (L102) respectively, wherein, the diameter of the outer pot of the polymerization kettle (D101) is 1650mm, and the storage Tank (F101) full volume 2.8m 3 , The diameter of the water inlet of the pump (J101) is 170mm.

[0016] The production device of photocurable solder resist printing materials for circuit boards. The production process is as follows: add epoxy resin, modified compound and acrylic acid to the polymerization kettle D101, and polymerize at 76°C for 3 hours to obtain photosensitive resin. Put the photosensitive resi...

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Abstract

The invention relates to a production device of a circuit board photocuring solder-resisting printing material. The production device mainly comprises a polymerization kettle (D101), a storage tank (F101), a pump (J101), a kneader (L101) and a grinding machine (L102), wherein the polymerization kettle (D101) is connected with the pump (J101) and the kneader (L101) respectively, the kneader (L101)is connected with the polymerization kettle (D101) and the grinder (L102) respectively, and the outer pot diameter of the polymerization kettle (D101) is 1600-1650mm.

Description

technical field [0001] The invention relates to a compound synthesis device, in particular to a production device for circuit board photocurable solder resist printing material. Background technique [0002] The photocurable solder resist printing material is mainly cured by ultraviolet light irradiation, and a layer of solder resist cured film is formed on the printed board to protect the places that do not need to be soldered. 2. After the welding is completed, it will be used as a permanent protective film for the printed circuit board to protect the circuit from moisture and pollutants in the atmosphere, thereby improving product reliability, prolonging service life, and avoiding high-temperature curing of thermosetting solder resist printing materials It is easy to deform and distort the circuit board, reduce the quality of components, consume a lot of energy, and reduce production efficiency. It is also used for welding and circuits that require moisture-proof, mildew-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/10G03F7/004C08G59/17
CPCC08G59/1466C09D163/10G03F7/004
Inventor 彭飞
Owner CHENGDU MI ER DUN TECH CO LTD