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Device and method for peeling two substrates

A technology of substrates and flexible substrates, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as lower yield rate and component damage, and achieve the effect of improving yield rate

Active Publication Date: 2018-07-03
MIRLE AUTOMATION CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such a process of cutting and separating the two substrates will inevitably fold the flexible substrate, causing damage to the components in the plating layer on the flexible substrate, resulting in lower yield

Method used

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  • Device and method for peeling two substrates
  • Device and method for peeling two substrates
  • Device and method for peeling two substrates

Examples

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Embodiment Construction

[0053] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, examples are given below to illustrate in detail with the help of drawings.

[0054] See Figures 1 to 12 . figure 1 It is a perspective view of the device 1 for peeling two substrates in a preferred embodiment of the present invention; figure 2 for figure 1 The top view of the device 1 for peeling two substrates; image 3 for along figure 2 Sectional view taken on section line A-A of ; Figure 4 for along figure 2 The sectional view taken on the B-B section line of ; Figures 5 to 6 for figure 1 A perspective view of the cutter 203 of the device 1 for peeling two substrates; Figure 7 for figure 1 A perspective view of the carrier tilting part 103 of the device 1 for peeling off two substrates; Figure 8 for figure 1 A stereoscopic view of the ion wind generator 104 of the device 1 for peeling off two substrates; Figure 9 ...

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PUM

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Abstract

The invention provides a device and method for peeling two substrates. According to the method, at least one blade is inserted into a bonding layer between a flexible substrate and a non-flexible substrate; and then the bonding layer is cut off completely so as to separate the flexible substrate and the non-flexible substrate. The provided device and method will not bend the flexible substrate after two substrates are separated, and thus the yield is increased.

Description

technical field [0001] The invention relates to the field of peeling off two substrates, in particular to a device and method for peeling off two substrates. Background technique [0002] Among the many flat panel displays, the organic light emitting display (OLED) has the potential to pose a real threat to the liquid crystal display device in the future. OLED is a display that basically uses organic compounds as constituent materials. OLED has a number of advantages that liquid crystal display devices lack, such as: strong contrast, high brightness, wide viewing angle, fast speed, low power consumption, thin and short, and can be rolled. [0003] In one stage of OLED manufacturing, the coating on a glass substrate (non-flexible substrate) is transferred to the active area in the middle of a flexible substrate through transfer printing technology, and the inactive area around the flexible substrate has a An adhesive layer that is bonded to the glass substrate and surrounds...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L27/32
CPCH01L21/67011H10K59/12H10K71/80H10K59/1201
Inventor 林大修
Owner MIRLE AUTOMATION CORPORATION