A kind of semiconductor device and its manufacturing method

Abstract

A semiconductor device and a manufacturing method therefor, the semiconductor device being provided with a cavity (1) which a conductive material encloses to form, the cavity may buffer an acting force when an active end structure and a passive end structure are in contact with one another, and the conductive material may guide static electricity which is produced by the contact, which prevents the generation of an electrostatic effect and therefore prevents the problems of adhesion and product failure which are caused by contact and impact.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a semiconductor device and a manufacturing method thereof. Background technique [0002] Miniaturized mechanical sensors developed and manufactured using semiconductor manufacturing processes, such as accelerometers, gyroscopes, oscillators, silicon wheat, pressure gauges, etc., are disturbed by external physical quantities, such as vibration, drop, impact, etc., the microstructure The movement of the body in the three-dimensional space will cause the deformation of the structure, and sometimes the surfaces of the structure will touch each other. [0003] Among them, when there are two or more microstructures that collide with each other and contact each other's surfaces, one of them is called the active end structure, and the other is called the passive end structure. Because in the microscopic scale, in addition to the frictional force generat...

AI Technical Summary

Problems solved by technology

At the same time, the spring recovery force of the structure is greater than the bonding force of the surface energy, which can also avoid the situation of sticky failure, but it will directly affect the limit of sensor sensitivity and dynamic range design

Images