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A kind of preparation method of liquid metal composite phase change material

A technology of composite phase change material and liquid metal, which is applied in the field of preparation of liquid metal composite phase change material, can solve problems such as short circuit of electronic circuit, damage to CPU, and influence on normal operation of CPU, so as to achieve efficient heat dissipation, prevent circuit short circuit, and satisfy The effect of heat dissipation

Inactive Publication Date: 2020-08-25
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the liquid metal can fully fill the micro-gap of the thermal interface, greatly improve the heat conduction rate of the heating element and the heat dissipation interface, and make the heat dissipation efficiency higher, but because the liquid metal is in a liquid state during operation, it is easy to cause short circuit problems in electronic circuits, which will directly Affect the normal operation of the CPU, or even damage the CPU

Method used

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  • A kind of preparation method of liquid metal composite phase change material
  • A kind of preparation method of liquid metal composite phase change material
  • A kind of preparation method of liquid metal composite phase change material

Examples

Experimental program
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Effect test

Embodiment example 1

[0020] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0021] Mix 1g of polyvinylidene fluoride, 7g of sodium chloride and 0.2g of carbon nanotubes mechanically, then put them into a cylindrical mold, put them in a 200°C oven for 4 hours, take out the product and immerse it in 90°C hot water to completely dissolve the inside sodium chloride, and finally dried in a vacuum oven at 100°C for 24 hours to obtain a cylindrical flexible carbon nanotube sponge carrier material, wherein the flexible demonstration is as follows figure 1 As shown, SEM as figure 2 As shown, TEM as image 3 As shown, Raman as Figure 4 shown.

[0022] (2) Preparation of liquid metal composite phase change materials:

[0023] The flexible carbon nanotube sponge support material prepared above was vacuumized at 100° C. for 24 hours to completely open the inner pores. Then the vacuum-treated carbon nanotube sponge support material and liquid metal Bi 45 Pb 23 sn 8 Cd 5 In 19 ...

Embodiment example 2

[0025] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0026] Mechanically mix 0.8g of polyvinylidene fluoride, 5g of sodium chloride and 0.3g of carbon nanotubes, then add them into a square mold, put them in a 220°C oven for 2 hours, take out the product and immerse it in 80°C hot water to dissolve it completely sodium chloride, and finally dried in a vacuum oven at 120°C for 18 hours to obtain a square flexible carbon nanotube sponge carrier material.

[0027] (2) Preparation of liquid metal composite phase change materials:

[0028]The flexible carbon nanotube sponge support material prepared above was vacuumized at 100° C. for 18 hours to completely open the inner pores. Then the vacuum-treated carbon nanotube sponge support material and liquid metal Bi 49 Pb 18 sn 12 In 21 At the same time, place it in a vacuum flask, heat it to 60°C to melt it, and use the pores of the carrier material to melt the liquid metal Bi 49 Pb 18 sn 12 In 21 Adso...

Embodiment example 3

[0030] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0031] Mechanically mix 0.6g of polyvinylidene fluoride, 6g of sodium chloride and 0.5g of carbon nanotubes, then add them into a rectangular mold, put them in an oven at 240°C for 1 hour, take out the product and immerse it in hot water at 85°C to dissolve completely The sodium chloride inside is finally dried in a vacuum oven at 140° C. for 20 hours to obtain a rectangular flexible carbon nanotube sponge carrier material.

[0032] (2) Preparation of liquid metal composite phase change materials:

[0033] Vacuumize the flexible carbon nanotube sponge carrier material prepared above at 100° C. for 20 hours to completely open the inner pores. Then the vacuum-treated carbon nanotube sponge support material and liquid metal Bi 50 Pb 27 sn 13 Cd 10 At the same time, place it in a vacuum flask, heat it to 75°C to melt it, and use the pores of the carrier material to melt the liquid metal Bi 50 Pb 2...

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Abstract

The invention provides a preparation method of a liquid-state metal composite phase-change material and belongs to the field of shaped composite phase-change materials. The preparation method comprises the following steps: firstly, uniformly mixing water-soluble metal salt, carbon nanotubes and a polyvinylidene fluoride raw material which have different ratios; putting a mixture into a mold with aspecific shape and drying; finally, dissolving metal salt in the mold in hot water to obtain flexible carbon nanotube sponge with a specific shape; putting a prepared flexible carbon nanotube spongecarrier material and liquid-state metal into a vacuum environment by adopting a melting impregnation method; selecting proper temperature to melt a liquid-state metal core material; adsorbing and limiting the liquid-state metal core material into a pore channel by utilizing the pore channel of the flexible carbon nanotube sponge carrier material under a vacuum environment; then cooling to obtain the liquid-state metal composite phase-change material. According to the preparation method provided by the invention, CPU (Central Processing Unit) efficient heat dissipation in different temperatureranges can be realized; controllable equipment of a pore channel structure is realized through changing types and ratios of raw material; the packaged shaped composite phase-change material can solvethe short-circuit problem, caused by free flowing of liquid-state metal, of an electronic element circuit; meanwhile, dynamic heat dissipation of flexible electronic components also can be met.

Description

technical field [0001] The invention belongs to the field of shaped composite phase change materials, and in particular relates to a preparation method of liquid metal composite phase change materials. Background technique [0002] Electronic heat dissipation is related to the life and reliability of electronic equipment, and is a bottleneck affecting the development of today's electronics industry. With the development of the three major trends of high performance, miniaturization, and integration in the electronics industry, the problem of heat dissipation is becoming more and more prominent. Especially for chips with high thermal load sensitivity, the accumulation of heat at the chip will seriously affect its stability and service life. Studies have shown that if the operating temperature of a single electronic component increases by 10°C, its reliability will be reduced by 50%; and the failure of the CPU is mostly caused by overheating. If a large amount of heat genera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/06
CPCC09K5/063Y02P20/10
Inventor 王戈陈晓高鸿毅董文钧邢立文王军勇陈思远郑海燕
Owner UNIV OF SCI & TECH BEIJING
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