S-type fluid path layout optimum design method specific to liquid cooling radiator

A layout optimization and design method technology, applied in design optimization/simulation, instruments, calculations, etc., can solve problems that are difficult for general technicians to apply, difficulty in engineering implementation, and problem convergence guarantee, and achieve the advantages of solution efficiency and convergence, and are easy to solve Programmatic implementation, the effect of reducing the number of calls

Active Publication Date: 2018-07-06
HUNAN CITY UNIV
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Problems solved by technology

However, the research on such methods is still in the preliminary stage, and there are still a series of technical difficulties that need to be solved urgently
First of all, since the objective function or constraints in the optimization model are based on numerical simulation technology, repeated calls to the time-consuming simulation model in the optimization process may lead to serious efficiency problems and convergence guarantees; second, such methods need to build mathematical models based on optimization theory, and implement Difficult to apply to general technicians

Method used

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  • S-type fluid path layout optimum design method specific to liquid cooling radiator
  • S-type fluid path layout optimum design method specific to liquid cooling radiator
  • S-type fluid path layout optimum design method specific to liquid cooling radiator

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Embodiment Construction

[0044] The present invention will be further described below with a collection of drawings and embodiments.

[0045] refer to figure 1 As shown, the present invention relates to an S-shaped runner layout optimization design method for liquid-cooled radiators, the steps are as follows:

[0046] Step one, determine the parameters of the integrated circuit board

[0047] refer to figure 2 As shown, according to the existing information, determine the parameters of the integrated circuit board, including the structural dimensions, position coordinates, materials, and heating power of the circuit board 100 and power devices 101-116, as listed in Table 1.

[0048] Table 1 Parameters of integrated circuit board

[0049]

[0050] Step 2, partition the integrated circuit board and specify the value range of the heat transfer coefficient of each area

[0051] refer to figure 2 As shown, the heat dissipation surface of the integrated circuit board and the liquid cooling radiat...

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Abstract

The invention discloses an S-type fluid path layout optimum design method specific to a liquid cooling radiator, which includes steps of confirming parameter of an integrated circuit board; partitioning the integrated circuit board and giving a valuing scale of a heat exchange coefficient in every zone; building a calculation model of the heat exchange coefficient and solving it; confirming a cooling plate parameter of the liquid cooling radiator; confirming basic layout and corresponding fluid path length of the S-type fluid path; structuring a geological function of the S-type fluid path; building the S-type fluid path layout optimum model and solving it; tiny adjusting the fluid path geological function and then outputting the optimum design scheme. According to the parameter of the integrated circuit board to be radiated, the method calculates the optimal heat exchange coefficient required by every zone of the radiating face of the circuit board and designs the corresponding S-typefluid path layout, thus the optimal radiating effect under the equal fluid path length is reached. Compared with the prior art, the method is featured by high efficiency and easy use.

Description

technical field [0001] The invention belongs to the field of structural design of electronic equipment, and in particular relates to a method for optimizing the design of S-channel layout for liquid-cooled radiators. Background technique [0002] With the increasing integration and power consumption density of electronic equipment components, heat dissipation design has become a very important link in the structural design of electronic equipment, and it is facing more and more challenges. Due to its high cooling efficiency, liquid-cooled radiators have been widely used in the heat dissipation design of electronic equipment; practice has proved that for electronic equipment with high power consumption density, liquid-cooled heat dissipation has a better effect than forced air-cooled heat dissipation. For liquid cooling radiators, various forms of flow channels have been developed, among which the S-shaped flow channel has become one of the most common forms of flow channels ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/23G06F2111/10
Inventor 黄志亮文明才曾琦
Owner HUNAN CITY UNIV
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