Prepreg cutting and drilling integrated device and machining process

A prepreg and cutting technology, which is applied in the processing of insulating substrates/layers, metal processing, electrical components, etc., can solve the problems of complex and tedious process flow, high scrap rate of prepreg, and high labor cost, and achieves simplified processing and production. Low cost and high degree of automation

Inactive Publication Date: 2018-07-13
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process separates the cutting and punching of the prepreg into two processes, and the prepreg needs to be sorted and transported manually many times in the middle. Punching deviation leads to high scrap rate of prepreg

Method used

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  • Prepreg cutting and drilling integrated device and machining process
  • Prepreg cutting and drilling integrated device and machining process
  • Prepreg cutting and drilling integrated device and machining process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0031] This implementation provides an integrated prepreg cutting and punching device, which is used for cutting and punching the prepreg coil, so that the processed prepreg is suitable for the subsequent pressing process.

[0032] The integrated device for cutting and punching the prepreg is as follows: figure 1 As shown, it includes a prepreg winding locking mechanism 1, a punching mechanism 2, a cutting mechanism 3 and a receiving mechanism 4 arranged in sequence, wherein the prepreg winding locking mechanism 1 is used to install a prepreg (PP) coil , the prepreg winding locking mechanism 1, such as figure 2 As shown, it includes at least one feeding shaft 11, the two ends of the feeding shaft 11 are connected to a support frame 12, and the feeding shaft 11 can rotate relative to the support frame 12, and the prepreg coil is installed on the feeding shaft 11 Above, the feed shaft 11 is equipped with a hand wheel for controlling the rotation of the feed shaft 11 and then m...

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PUM

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Abstract

The invention discloses a prepreg cutting and drilling integrated device. The prepreg cutting and drilling integrated device comprises a prepreg coiling and locking mechanism, a punching mechanism, acutting mechanism and a collection mechanism. The punching mechanism and the cutting mechanism are progressive die mechanisms. The cutting mechanism and the collection mechanism are connected througha conveying mechanism. According to the prepreg cutting and drilling integrated device, the punching mechanism is additionally arranged in front of a cutting position and can complete the punching procedure before cutting. The prepreg cutting and drilling integrated device is high in punching precision, not prone to deviation and low in product rejection rate. The punching procedure is conducted before the cutting procedure. Time consumed for manually collecting and stacking plates is saved. The number of equipment purchasing types is reduced. The connection time between a slicing machine anda punching machine and the preparation time are saved. The production efficiency is improved. The production cost is lowered. The requirements for automatic production are met. The invention further discloses a machining process. The machining process is high in machining precision, efficiency and automation degree and low in production cost.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to a prepreg processing device and process, in particular to a prepreg cutting and punching integrated device and processing technology. Background technique [0002] Prepreg, also known as PP sheet, is mainly composed of resin and reinforced materials, and has been widely used in printed circuit board technology. The prepreg is a thin sheet material formed by treating a reinforced material (such as glass fiber cloth) with resin impregnation and curing to an intermediate level. It can be used as a bonding material and an interlayer insulating material for the inner conductive pattern of a multilayer printed circuit board. . Usually a multi-layer printed circuit board is formed by laminating and laminating the core board and the prepreg. The prepreg forms the wetting layer and plays the role of bonding the core board. Although it has a certain initial thicknes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D9/00B26D7/32B26F1/14B26F1/24H05K3/00
CPCB26D7/32B26D9/00B26F1/14B26F1/24H05K3/005H05K3/0052H05K2203/0221H05K2203/0228
Inventor 管术春何小强段绍华
Owner 江西景旺精密电路有限公司
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