Electronic module with fingerprint recognition sensitivity improved

Abstract

The invention discloses an electronic module with fingerprint recognition sensitivity improved. The electronic module comprises an electrochromic cover plate, a fingerprint recognition chip, a substrate, a reinforcing plate, two connection lines and a flexible circuit board, the reinforcing plate is composed of a free end and a connection end which are arranged oppositely, the flexible circuit board is fitted on one side of the connection end, and the electrochromic cover plate can be driven by the electrochromic cover plate to realize color change; embossed patterns are arranged on the surface of the reinforcing plate and used for reducing deformation generated when receiving pressure. The connection lines are arranged on two sides of the fingerprint recognition chip and the substrate. The electrochromic cover plate is driven by the circuit board to realize change of appearance color of the fingerprint recognition module, so that user experience is improved; the electronic module canlower capacitance detection accuracy and improve sensitivity of the fingerprint recognition chip.

Description

technical field [0001] The invention relates to the technical field of fingerprint recognition security, in particular to an electronic module with improved fingerprint recognition sensitivity. Background technique [0002] With the development of technology, fingerprint identification modules have been more and more widely used in various portable electronic devices. For example, there is an existing class of smartphones equipped with a fingerprint identification module, through which users can identify fingerprints to realize functions such as mobile phone unlocking and fingerprint identification payment. The current fingerprint identification module usually includes a fingerprint identification chip and a reinforcement board, and the reinforcement board is used to support the fingerprint identification chip. The existing reinforcement board has a large area and smooth surface. During the production and transportation process, the reinforcement board is easily affected by...

AI Technical Summary

Problems solved by technology

The existing reinforcement board has a large area and a smooth surface. During the production and transportation process, the reinforcement board is easily affected by stress, resulting in deformation and warping, which will lead to Can cause false soldering, resulting in circuit failure and poor function in electronic devices

[0003] At the same time, one end of the connection wire of the existing fingerprint recognition module is connected to the substrate, and the other end of the connection wire is connected to the upper surface of the fingerprint recognition chip. The connection wire and the fingerprint recognition chip are sandwiched between the substrate and the cover plate. The curved shape and the top protrude from the upper surface of the fingerprint identification chip, resulting in a large distance between the fingerprint identification chip and the cover. The fingerprint identification chip detects the capacitance value between the ridges and valleys on the surface of the finger above the cover and the fingerprint chip. Reduce the accuracy of capacitance detection, thus affecting the sensitivity of fingerprint recognition chips

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