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High withstand-voltage passive component

A passive component and high withstand voltage technology, which is applied in the direction of electrical components, transformer/inductor components, and capacitors that change the effective area of ​​electrodes, etc. It can solve the problems of occupying a considerable space, limited withstand voltage, and low impedance.

Active Publication Date: 2018-07-13
INSIGHT ELECTRONICS GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In addition, the above-mentioned coils are formed by a printed circuit. However, the conventional technology usually uses glass cloth such as FR4, phenolic tissue paper or epoxy resin as the substrate of the printed circuit board. Such materials have a certain thickness and low impedance. If To increase the impedance of the coil and the circuit board, it is necessary to increase the thickness of the substrate. Therefore, even if the inductance component is formed in the form of a printed circuit in the conventional technology, it still needs to occupy a considerable space and has a limited withstand voltage.
[0004] To sum up, the conventional capacitors and inductors have the defects of oversized volume and poor voltage resistance. It is necessary to further improve them so that they have high voltage resistance characteristics without occupying a large amount of circuit layout space.

Method used

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Embodiment Construction

[0037] In order to make the structural features of the present invention and the achieved effects have a further understanding and recognition, preferred embodiments and detailed descriptions are specially used, which are described as follows:

[0038] Please also refer to image 3 and Figure 4 , image 3 It is a schematic diagram of the first embodiment of the high withstand voltage passive component of the present invention, Figure 4 It is an exploded view of the first embodiment. As shown in the figure, the high withstand voltage passive device of the present invention includes a multilayer board 10 , a plurality of conductive films 20 , and an iron core assembly 30 .

[0039] The multilayer board 10 of the present invention is formed by stacking a plurality of pressure-resistant substrates 100 and a plurality of bonding materials 101 . In addition, the conductive film 20 is respectively disposed on the voltage-resistant substrates 100 to form circuit loops on the vol...

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Abstract

The present invention is a high withstand-voltage passive component. The passive component comprises a multi-layered board formed by stacking a plurality of withstand-voltage substrates and a bondingmaterial, wherein the withstand-voltage substrate is provided with a plurality of conductive films; an iron core penetrates through a perforation of the withstand-voltage substrates; the conductive film respectively comprises a non-annular part and an annular part, wherein the withstand-voltage substrate and the bonding material are polyimide.

Description

technical field [0001] The invention relates to a passive component, in particular to a high-voltage resistant passive component and its structure. Background technique [0002] Nowadays, with the rapid development of science and technology, many electronic products are designed for the purpose of miniaturizing the internal circuit space of the product in consideration of convenience and manufacturing cost, and a large number of printed circuit boards are used. However, there are often two necessary components in electronic products, resulting in their volume. One of the limitations is a capacitor. A capacitor is composed of two conductors containing their dielectric. The area and distance of the conductors affect its capacitance value, so it is difficult to shrink the capacitor. Another size-constrained component is the inductor, see figure 1 , figure 2 , is a schematic diagram of a conventional inductance component, which includes an iron core group and a coil. The iron...

Claims

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Application Information

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IPC IPC(8): H01G5/04H01G5/40H01F27/28
CPCH01F27/2804H01F2027/2809H01G5/04H01G5/40
Inventor 黄瑞兴
Owner INSIGHT ELECTRONICS GROUP