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A semi-submerged micro electrolytic wire cutting fixture and radial flushing method

A technology of cutting processing and electrolytic wire, which is applied in the field of micro-electrochemical processing, can solve the problems of unable to discharge processed products in time, influence of electric double layer, damage, etc., to ensure processing quality and processing efficiency, good portability and developability Effect

Inactive Publication Date: 2019-09-10
HOHAI UNIV CHANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But when the processing gap is too small, there are two key problems
First of all, although processing requires a large amount of electrolyte, in some cases, processing completely immersed in the electrolyte will have a certain impact on the electric double layer on the surface of the workpiece
[0005] Secondly, the processed products (floc and air bubbles) produced during the processing cannot be discharged in time, and the fresh electrolyte cannot enter the processing gap in time, the floc will prevent the reaction from proceeding, and the air bubbles will cause the wire electrode to bend even damaged

Method used

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  • A semi-submerged micro electrolytic wire cutting fixture and radial flushing method
  • A semi-submerged micro electrolytic wire cutting fixture and radial flushing method
  • A semi-submerged micro electrolytic wire cutting fixture and radial flushing method

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Embodiment

[0040] In this embodiment, two relative movements between the wire electrode and the workpiece are involved. The first is the feed motion between the wire electrode and the workpiece; see appendix Figure 4 , as shown in the figure, under the control of the high-precision motion system, the wire electrode and the workpiece carry out continuous relative motion according to the processing trajectory. Process the required workpiece.

[0041] However, in the process of processing, a large number of processed products, namely air bubbles and flocs, will be produced in the processing gap. The existence of air bubbles and flocs can easily lead to the bending of the wire electrode, which greatly affects the processing, so the process of wire transportation is essential, such as Figure 5 shown. The wire electrode performs slight reciprocating motion along its own axis (the arrow on the left refers to the feed of the wire electrode, and the arrow on the right refers to the slight re...

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Abstract

The invention discloses a clamp for semi-immersed type electrochemical micro linear cutting machining and a radial flushing method. A linear electrode is fixed to the clamp and placed above an electrolytic bath. One end of a flushing hole is connected with an adjustable micro peristaltic pump, and the other end is connected with an inner cavity. Electrolyte in the electrolytic bath is pumped intothe clamp by the adjustable micro peristaltic pump and enters the inner cavity through the flushing hole. When a workpiece is machined, the linear electrode is aligned at the workpiece and transversely moved and fed towards the workpiece. When the workpiece is in contact with the linear electrode and electrochemical machining begins, machining products produced in the machining process are removedthrough relative movement between the linear electrode and the workpiece and the flushing liquid of the adjustable micro peristaltic pump. Through the special clamp and the flushing method, the removal of floccules and air bubbles, which are produced in the machining process, by the linear electrode is ensured, the machining stability is greatly improved, and the operation is convenient and easyto realize.

Description

technical field [0001] The invention relates to a semi-submerged micro-electrolytic wire cutting processing fixture and a radial flushing method, belonging to the technical field of micro-electrochemical processing. Background technique [0002] With the continuous progress of modern science and technology, the miniaturization and precision of products has become one of the main development trends. More and more microdevices and microstructures are being used in industrial fields such as medical treatment, electronics, new energy, and national defense. The continuous emergence of new micro-devices and micro-structures has driven the demand for the manufacture of metal micro-structures. The corresponding micro-processing technology has become one of the fastest-growing and most dynamic science and technology, and is highly valued by countries all over the world. [0003] Micro electrochemical machining technology, the material transfer of micro electrochemical machining tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H5/02B23H5/14
CPCB23H5/02B23H5/14
Inventor 陆悦于洽许银海徐春望段泽楠
Owner HOHAI UNIV CHANGZHOU