Component soldering method

Abstract

The invention discloses a component soldering method which comprises the following steps of filling a thermosetting tin soldering composition into multiple pins of a component firstly, then insertingmultiple pins of an electronic element with the pins filled with the thermosetting tin soldering composition into multiple soldering holes of a circuit board, then putting the circuit board carrying the electronic element in a heating device, performing heating to a reaction temperature to enable the tin soldering composition to generation reaction after being heated, and forming a tin soldering layer with curing within a reaction time, and fixing multiple pins on the circuit board through contact of multiple soldering holes and the tin soldering layer. The method can improve the tin solderingquality, lowers the production cost and does not need wave soldering equipment in the process.

Description

technical field [0001] The invention relates to a welding method applied to the welding operation of electronic components, in particular to a welding method which does not need to go through wave soldering equipment. Background technique [0002] Many electronic components are usually arranged on the circuit board, and the pins of the multiple electronic components are fixed to the welding holes of the circuit board through a welding process. In modern technology, when common electronic components such as resistors, capacitors or diodes are soldered, wave soldering equipment is usually used to complete the soldering of the pins. The nozzles in the wave soldering equipment can make liquid solder flow upwards to form a Wave crest, when the circuit board passes through the wave crest, the bottom surface of the circuit board is in contact with the wave crest to fill the soldering hole with liquid solder. After passing through the wave crest, it is cooled and solidified to compl...

AI Technical Summary

Problems solved by technology

[0003] However, when the multi-pins of each electronic component are arranged at a fine pitch (pitch less than 2.5mm), it is often found that there is a short circuit between these pins after passing through the wave peak, which is commonly called "solder bridge" in the industry. "Phenomenon, in this case, it is necessary to manually use a soldering iron to disconnect the solder bridge to eliminate the secondary processing of the short circuit, which seriously affects the soldering quality and production efficiency

[0004] Furthermore, wave soldering requires high equipment costs and high power consumption (the temperature for forming a soldering must reach 257°C), and the main materials used in wave soldering (such as flux and tin rods) cannot be fully utilized in the process , resulting in cost waste; and, the procedure of wave soldering is relatively complicated, which can easily lead to poor soldering (produced tin tip, tin bridge or empty soldering, etc.); in addition, toxic substances will be produced during the wave soldering process, so there are safety concerns

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