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Vacuum film pasting apparatus and method

A film sticking device and vacuum technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of bonding strength influence, poor bonding, etc., to improve air density, improve yield, improve quality and yield Effect

Active Publication Date: 2018-07-24
MAVEN OPTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if proper lamination equipment and film laminating procedures are not used, the joint glue has been pre-heated and partially cured before the film and the film to be laminated are fully bonded, and the bonding strength between the film and the film to be filmed will be affected. , resulting in poor fit

Method used

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  • Vacuum film pasting apparatus and method
  • Vacuum film pasting apparatus and method
  • Vacuum film pasting apparatus and method

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Embodiment Construction

[0099] see Figure 1 to Figure 3 As shown, it is a schematic diagram of a vacuum film sticking device 10 according to a preferred embodiment of the present invention, wherein figure 1 and figure 2 The top plate 111 of the cavity 110 is not shown in order to view the internal structure of the vacuum film sticking device 10 . The vacuum laminating device 10 may include a vacuum chamber module 100 , a lamination module 200 , a carrying module 300 and a heating platform 400 , and the technical contents of these components are described in sequence as follows.

[0100] The vacuum chamber module 100 can provide a vacuum environment for vacuum film lamination, and its structure can include a cavity 110, an airtight sliding bearing 120 and a vacuum system control device 130, the airtight sliding bearing 120 and the control device 130 are all disposed on the cavity 110 .

[0101] Specifically, the cavity 110 defines an accommodating space 110A, and the pressure therein is controlla...

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Abstract

The invention provides a vacuum film pasting apparatus. The vacuum film pasting apparatus comprises a vacuum cavity module, a film pressing module, a bearing module and a heating platform, wherein thefilm pressing module comprises a film pressing plate; and the bearing module comprises a bearing plate and a spring device. When the vacuum film pasting apparatus acts, the film pressing plate presses a film downwards to drive the bearing plate to move to the heating platform so as to heat the film sheet to enable jointing adhesive to be cured and laminated; after heating is completed, the film pressing plate moves upwards, and the spring device can release the spring potential energy pre-stored in lamination, and drives the bearing plate to move upwards to recover to the initial position. The invention also provides a vacuum film pasting method; and by virtue of the vacuum film pasting apparatus and method, lamination shortcoming caused by air bubbles between the film sheet and the to-be-pasted film part can be reduced, and the combination force between the film sheet and the to-be-pasted film part can be improved.

Description

technical field [0001] The present invention relates to a film sticking device and method, in particular to a vacuum film sticking device and method. Background technique [0002] In the electronics industry, it is often necessary to attach various soft or hard films to electronic devices such as semiconductor components, circuit components (resistors or capacitors, etc.) or liquid crystal display panels to endow these electronic devices with specific functions, or To achieve the purpose of protecting electronic devices and making electronic devices waterproof. [0003] In addition to providing protection or waterproof functions, flexible or hard films (such as resin films) can also be made into optical films with properties such as light transmission, semi-transmission or light conversion. For example, the diaphragm can be added with dyes, light scattering particles, fluorescent materials and other substances to obtain the required optical properties such as light filterin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L33/50
CPCH01L21/67132H01L33/505H01L2933/0041
Inventor 陈杰廖俊旭吴秉霖王秀文
Owner MAVEN OPTRONICS CO LTD
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