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Two-way pressure liquid cooling heat radiation structure

A liquid-cooled heat dissipation and cooling liquid technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical equipment structural parts, instruments, etc., to achieve the effects of simple structure, improved heat dissipation effect, and convenient installation

Pending Publication Date: 2018-07-24
APALTEK DONGGUAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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The current technology still needs to be further improved

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  • Two-way pressure liquid cooling heat radiation structure
  • Two-way pressure liquid cooling heat radiation structure
  • Two-way pressure liquid cooling heat radiation structure

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] The patent of the present invention discloses a high-efficiency liquid cooling and heat dissipation structure with two-way pressure, which mainly includes a pumping device, a heat absorbing device 5 and a sealing device 4 . The heat absorbing device 5 is a metal structure with high thermal conductivity such as copper / aluminum / silver. The sealing device 4 is a rubber seal. The main features of the above heat dissipation structure are: high heat exchange...

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Abstract

The objective of the invention is to provide a two-way pressure liquid cooling heat radiation structure. The structure comprises: a heat absorption device formed by a metal piece, one surface of the metal piece is provided with a groove space structure configured to allow cooling liquid to move, the cooling liquid flows along the groove, the other surface of the metal piece is attached to a heating device to perform a heat conduction effect with the heating device; a seal device which is a rubber seal piece and is configured to prevent the cooling liquid from generation of leakage; and a pumping device comprising a pump housing, a motor, an impeller and a rotating bearing system, wherein the pump housing, the heat absorption device and the seal device form a single pressure cavity, the impeller rotates in the single pressure cavity to generate vertical and parallel two-way pressure in the cooling liquid in the heat absorption device so as to improve the heat exchange efficiency. The two-way pressure liquid cooling heat radiation structure is improved in heat radiation efficiency, meets the heat radiation product requirements on the market, improves the service life and saves the cost.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic products, in particular to a liquid-cooled heat dissipation structure with bidirectional pressure application. Background technique [0002] Since liquid cooling radiators are used in electronic equipment (such as computers), there are many types of products, and the structure of the water cooling head is also different. Since the water cooling head is directly in contact with the heat source of the equipment, the internal structure of the water cooling head is also important for the heat dissipation effect. influences. Nowadays, consumers are more and more familiar with this kind of heat dissipation products, and their requirements are getting higher and higher. While satisfying the performance, the appearance, materials, vision, and lighting have all become very important. The current technology still needs to be further improved. Contents of the invention [0003] The object of...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/20272G06F1/20G06F2200/201H05K7/20263H01L23/473H01L23/3672
Inventor 肖启能
Owner APALTEK DONGGUAN CO LTD