Low-lead release brass alloy

A brass alloy and master alloy technology, applied in the coating process of metal materials, etc., can solve the problems of organic film shedding and affecting the health of drinking people, and achieve the effects of reducing lead dissolution, inhibiting lead dissolution, and dense and firm oxide film

Active Publication Date: 2018-07-31
慈溪市永丰铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the organic film on its surface will easily fall off during the installation process and under the impact of water flow, so that lead elements can enter the water again, thus affecting the health of drinking people

Method used

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  • Low-lead release brass alloy

Examples

Experimental program
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Effect test

Embodiment

[0030] The alloy compositions of the samples of Examples 1-5 and Comparative Group 1 and Comparative Group 2 are shown in Table 1, and rods of Φ22 mm were manufactured.

[0031] The production process of the alloys listed in Table 1 is the same, try to ensure comparability. The production process is as follows:

[0032] (1) each component is batched according to proportioning;

[0033] (2) Heating to 1000-1050°C for smelting, using a horizontal continuous casting process to produce ingots;

[0034] (3) The ingot is heated up to 550°C, and then extruded in a 1350-ton extruder at an extrusion speed of 10mm / s, and the extruded billet is cooled and interrupted;

[0035] (4) The interrupted extruded billet is peeled to remove surface defects, then stretched, straightened, and subjected to stress relief annealing to obtain a finished brass alloy.

[0036] The surface of the brass alloy is passivated, and the passivation method comprises the following steps:

[0037] (a) Degreasi...

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PUM

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Abstract

The invention discloses a low-lead release brass alloy. The low-lead release brass alloy comprises copper accounting to 50%-65% of the total weight of the brass alloy by weight, lead accounting to 0.5%-1.5% of the total weight of the brass alloy by weight, sulphur accounting to 0.001%-0.0055% of the total weight of the brass alloy by weight, tellurium accounting to 0.001%-0.06% of the total weightof the brass alloy by weight, molybdenum accounting to 0.015%-0.2% of the total weight of the brass alloy by weight, zirconium accounting to 0.1%-0.5% of the total weight of the brass alloy by weight, nickel accounting to 0.01%-0.5% of the total weight of the brass alloy by weight, manganese accounting to 0.001%-0.05% of the total weight of the brass alloy by weight, iron accounting to 0.05%-0.5%of the total weight of the brass alloy by weight, boron accounting to 0.0001%-0.0015% of the total weight of the brass alloy by weight, silicon accounting to 0.001%-0.1% of the total weight of the brass alloy by weight and the balance zinc and inevitable impurities. The low-lead release brass alloy has the beneficial effects that lead release of the zinc-containing brass alloy is restrained, andthe surface metal oxide film is compact and not prone to stripping.

Description

technical field [0001] The invention relates to a brass alloy, in particular to a brass alloy with low lead leaching. Background technique [0002] Lead brass is an extremely important and most widely used complex brass, with excellent cutting performance and wear resistance. Lead brass contains less than 3% lead. In addition, a small amount of Fe, Ni or Sn is often added to exist in a free state in the structure, which splits the matrix and makes lead brass have good machinability and friction reduction. [0003] The effect of lead composition on the properties of copper alloys: [0004] 1. Lead does not dissolve in copper, and the solid solubility in copper alloy is also very small. It forms a eutectic structure with copper. In solid state, lead is distributed in copper in a simple state, and can be distributed in the grain and grain boundary. For lead-containing brass strips, when phase transformation and recrystallization occur again, the lead at the grain boundary can...

Claims

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Application Information

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IPC IPC(8): C22C9/04C22C1/03C22F1/08C23C22/52
CPCC22C1/03C22C9/04C22F1/08C23C22/52
Inventor 张方毅陈占清李新义
Owner 慈溪市永丰铜业有限公司
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