A material with adjustable negative thermal expansion coefficient and its preparation method and application

A technology with negative coefficient of thermal expansion and coefficient of thermal expansion, which is applied in the field of materials with adjustable negative thermal expansion coefficient and its preparation and application, can solve problems such as narrow working temperature range, mechanical, heat conduction, and electrical conduction properties that need to be improved, and cannot be greatly adjusted.

Active Publication Date: 2020-07-28
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the negative thermal expansion coefficients of these new materials cannot be greatly adjusted, and the working temperature range is relatively narrow, and the mechanical, thermal and electrical properties also need to be improved.

Method used

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  • A material with adjustable negative thermal expansion coefficient and its preparation method and application
  • A material with adjustable negative thermal expansion coefficient and its preparation method and application
  • A material with adjustable negative thermal expansion coefficient and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] The composition of MnCoGe-based materials: Mn 1-x In x CoGe (x = 0.01, 0.03), the mass ratio of the balls in step 4) is 1:1, the epoxy resin in step 5) is 5%, the curing agent ratio is 8%, and the pressing conditions in step 6) are: Apply 1.3 GPa pressure and press for 5 minutes, and the curing conditions are: curing at 250°C for 1.5 hours.

Embodiment 2

[0072] The composition of MnCoGe-based materials: MnCo 1-y In y Ge (y = 0.015, 0.03), the mass ratio of ball to material in step 4) is 5:1, the epoxy resin in step 5) is 10%, the curing agent ratio is 12%, and the pressing conditions in step 6) are: Apply 0.1 GPa pressure and press for 1 minute, and the curing conditions are: curing at 100°C for 2 hours.

Embodiment 3

[0074] The composition of MnCoGe-based materials is: MnCoGe 1-z In z (z=0.01), the mass ratio of the ball material in step 4) is 10:1, the epoxy resin glue in step 5) is 4%, the curing agent ratio is 12%, and the pressing conditions in step 6) are: 1.5 GPa applied The pressure, pressing for 20 minutes, and the curing conditions are: curing at 170°C for 1 hour.

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Abstract

The invention provides a material with adjustable negative thermal expansion coefficient and its preparation method and application. The material is a MnCoGe-based and MnNiGe-based alloy. The material is introduced by high-energy ball milling to realize residual stress and defects, and at the same time control the particle size of the material 0.3 to 200 μm. The invention introduces residual stress and different degrees of structural defects through high-energy ball milling, while controlling particle size, and can realize continuously adjustable negative thermal expansion behavior and ultra-low thermal expansion in MnCoGe-based or MnNiGe-based alloy single metal materials. The thermal conductivity, electrical conductivity, and mechanical properties of the bonded particle molding material of the present invention can be greatly adjusted by selecting parameters such as binders with different characteristics and molding processes, so the material of the present invention is suitable for the preparation of high-precision optical instruments and low temperature coefficient mechanical parts. Has important practical value.

Description

Technical field [0001] The invention relates to a material capable of adjusting negative thermal expansion coefficient and realizing ultra-low thermal expansion, and a preparation method and application thereof. Background technique [0002] The thermal expansion effect refers to the effect that the volume of an object changes with the change of temperature, and the thermal expansion coefficient is used to measure the magnitude of the volume change caused by the thermal expansion effect. Most solid materials have a positive thermal expansion effect, that is, as the temperature rises, the material expands; very few solid materials have a negative expansion effect. [0003] However, in practical applications, many high-precision optical instruments and mechanical parts with low temperature coefficients often require the use of materials with precise thermal expansion coefficients or even zero expansion coefficients. At present, the way people obtain materials with precise thermal ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C30/00C22C1/02B22F9/04B22F1/00B22F3/02B22F3/24C22C1/04
CPCC22C1/02C22C30/00B22F3/02B22F3/24B22F9/04B22F2009/043B22F2003/248B22F1/10C22C1/047
Inventor 沈斐然胡凤霞匡皓梁飞翔乔凯明李佳刘瑶王晶孙继荣沈保根
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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