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Film package and method for producing film package

A film roll, roll core technology, applied in the direction of conductive layer on insulating carrier, film/sheet without carrier, film/sheet release liner, etc., can solve the problem of difficulty in obtaining temporary fit and achieve excellent temporary fit effect

Active Publication Date: 2021-03-02
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to obtain excellent temporary adhesion when sticking the concave surface of the adhesive film on the adherend such as a substrate

Method used

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  • Film package and method for producing film package
  • Film package and method for producing film package
  • Film package and method for producing film package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] The peeling film which has the A side whose peeling force Ta is 0.05 N / cm, and the B side whose peeling force Tb is 0.01 N / cm was prepared.

[0084] 50 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by mass of bifunctional acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Co., Ltd.) Parts by mass, 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Shin-Nakamura Chemical Co., Ltd.), 5 parts by mass of dilauroyl peroxide (trade name: Nyper BW, manufactured by NOF Corporation) 5 parts by mass and 5 parts by mass of conductive particles (product name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were uniformly mixed by a conventional method to prepare a radical-based ACF composition.

[0085] After applying the above-mentioned composition to the B side of the peeling film so as to have a thickness of 25 μm, the cover film was attached, and the ACF was cut i...

Embodiment 2

[0088] A film roll was obtained in the same manner as in Example 1 except having prepared a peeling film having a peeling force Ta of the A surface of 0.03 N / cm and a peeling force Tb of the B surface of 0.01 N / cm. Table 1 shows the evaluation results of the film package of Example 2.

Embodiment 3

[0090] A film roll was obtained in the same manner as in Example 1 except having prepared a peeling film having a peeling force Ta of the A surface of 0.08 N / cm and a peeling force Tb of the B surface of 0.01 N / cm. Table 1 shows the evaluation results of the film package of Example 3.

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Abstract

Provided are a film roll capable of obtaining excellent temporary adhesion and a method for manufacturing the film roll. The film package includes: an adhesive film (2) having a first surface (concave surface) formed in the longitudinal direction so that the thickness of both end portions in the width direction is greater than the thickness of the central portion, and an adhesive film formed on the opposite side of the first surface. the flat second side (flat side); the release film (3), which has a heavy release side with a relatively high release force, and a light release surface with a relatively low release force; and a reel (4), which will stick The bonding film and the peeling film are wound on the core, and the first surface of the film package contacts the heavy peeling surface of the peeling film (3) with the first surface of the adhesive film (2), and the second surface of the bonding film (2) It is packaged in such a way that the surface is in contact with the light release surface of the release film (3).

Description

technical field [0001] The present invention relates to a film package formed by winding an adhesive film such as ACF (Anisortropic Conductive Film) or NCF (NonConductive Film, non-conductive film) and a method for manufacturing the film package. This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2015-228229 filed in Japan on November 20, 2015, and this application is incorporated herein by reference. Background technique [0002] Conventionally, adhesive films such as ACF and NCF have been obtained through a slitting process of cutting (slitting) a wide adhesive film into a narrow width of, for example, 1 to 3 mm in width. In the adhesive film after the slitting step, one surface is raised in the slitting direction, and the other surface is flat (for example, refer to Patent Document 1). [0003] That is, the adhesive film after the slitting process has a surface (concave surface) on one side in which the thickness of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10B65H75/14C09J9/02H01B5/14
CPCB65H75/14C09J9/02H01B5/14C09J2203/326C09J7/10C09J2301/312C09J7/40
Inventor 荒木雄太
Owner DEXERIALS CORP