Wafer polishing device and polishing head used for the device
A polishing device and polishing head technology, which is applied to grinding devices, grinding machine tools, manufacturing tools, etc., can solve the problems of in-plane distribution deviation and large in-plane deviation, and achieve the effect of improving uniformity
Active Publication Date: 2022-03-01
SUMCO CORP
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[0011] However, in the case where the inner diameter of the film is smaller than the diameter of the support plate and the height dimension of the inner side of the film is almost the same as the height of the support plate, based on the horizontal direction (lateral direction) of the main surface of the film in contact with the wafer The tension is greater than the tension in the vertical direction (longitudinal direction) of the side surface of the film, so there is a problem that the in-plane distribution of the pressing force of the film is deviated, resulting in in-plane deviation of the polishing amount (removal amount) of the wafer get bigger
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[0046] It was evaluated how the ratio of the film to the aspect ratio of the support plate affects the in-plane distribution of the polishing volume of the wafer. In this evaluation test, a P-type silicon wafer with a diameter of 450 mm and a thickness of 925 μm cut out from a single crystal silicon ingot with a crystal orientation (100) grown by the Chowklarsky method and polished on both sides was prepared. The wafer is mirror-polished by the wafer polishing device of the polishing head of the film pressurization method. In the polishing step, a slurry having a silica concentration of 0.3 wt / % and a silica particle diameter of 35 nm was used, or a suede-type polishing pad was used. The rotation speed of the polishing head and the rotary platform is 40 rpm, the membrane pressure is 10 kPa, and the target polishing amount (removal amount) is 1 μm.
[0047] In the polishing step, a plurality of film samples having different vertical and horizontal dimensions are prepared, and ...
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Abstract
The present invention provides a wafer polishing device capable of improving the uniformity of polishing amount in a wafer surface. A wafer polishing device (1) includes a rotary table (21) to which a polishing pad (22) is attached, and a polishing head (10) that presses and holds a wafer (W) placed on the polishing pad (22). A buff head (10) includes a film (16) that abuts on an upper surface of a wafer (W) to apply a pressing force, and a support plate (15) that supports the film (16). The membrane (16) has a main surface (16a) facing the bottom surface of the support plate (15) and a side surface (16b) facing the outer peripheral end surface of the support plate (15), based on the side surface of the membrane (16) ( 16 b ) has a longitudinal tension greater than a transverse tension based on the main surface ( 16 a ) of the film ( 16 ).
Description
technical field [0001] The invention relates to a wafer polishing device and a polishing head used in the device, in particular to a film pressurizing polishing head and a wafer polishing device using the polishing head. Background technique [0002] Silicon wafers are widely used as substrate materials for semiconductor devices. A silicon wafer is manufactured by sequentially performing the following processes on a single crystal silicon ingot: peripheral grinding, slicing, lapping, etching, double-side polishing, single-side polishing, cleaning, and the like. Among them, the single-side polishing process is a necessary process for eliminating unevenness or undulations on the wafer surface to improve flatness, and the CMP (Chemical Mechanical Polishing: chemical mechanical polishing) method is used for mirror processing. [0003] Generally, a single-wafer wafer polishing apparatus (CMP apparatus) is used in a single-side polishing process of a silicon wafer. This wafer po...
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IPC IPC(8): H01L21/304B24B37/30
CPCB24B37/30B24B37/04H01L21/304B32B3/08H01L21/67219
Inventor 寺川良也谷本龙一金子裕纪
Owner SUMCO CORP