FPC hollowed-out circuit board preparation technology

Abstract

The invention discloses an FPC hollowed-out circuit board preparation technology, including the following steps: 1, performing RTR target drone punching on a copper foil; 2, performing CNC drilling ona covering film; 3, attaching the copper foil after punching to the covering film after drilling; 4, performing press-fitting on the attached copper foil and covering film to obtain a semi-finished product; 5, performing dry film pasting treatment, exposure treatment, developing treatment and etching treatment in sequence on the semi-finished product obtained in Step 4; and 6, performing coveringlayer pasting treatment on the semi-finished product after Step 5 is completed. The FPC hollowed-out circuit board preparation technology uses CNC equipment and RTR target punching equipment to perform perforation on the covering film and the copper foil, and then the covering film and the copper foil are attached to each other, the circumstance that dislocation of a printed circuit occurs in a subsequent exposure process is overcome, and improvement of the yield of products is facilitated; and in addition, precision of hole locations in the copper foil is high, so that a material pulling device can normally pull materials in an RTR manufacturing process, thereby ensuring long-time stable work of an FPC hollowed-out circuit board production line.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing and manufacturing, in particular to the preparation process of FPC hollow circuit boards. Background technique [0002] FPC circuit board (flexible circuit board) has been widely used in mobile phones, digital cameras, notebook computers, avionics and medical equipment due to its advantages of lightness, smallness, thinness, bendability and easy assembly. FPC hollow circuit boards can achieve double-sided conduction on the basis of a single layer, which is especially widely used. However, due to current technical limitations, the industry adopts traditional manufacturing processes. The traditional manufacturing process is S1: using molds on the cover film Upper punching; S2: Paste the cover film on the copper foil; S3: Press the cover film and copper foil; S4: Perform target punching on the copper foil on the target punching machine according to the hole position on the co...

AI Technical Summary

Problems solved by technology

In step S1, because the whole roll of cover film is used to punch holes in the LPF mold, when the LPF equipment pulling component is pulling the cover film, the precision of the pulling step distance of the pulling component and the mold is low, and the cover film is prone to tension. Deformation, so that the size of the hole position changes, so that the subsequent exposure equipment cannot be aligned, and the FPC hollow circuit board production line cannot work stably for a long time

Moreover, the cumulative error caused by punching the cover film with the mold will cause serious deviations in the subsequent printed circuit, resulting in a low product yield