The invention discloses an FPC hollowed-out circuit board preparation technology, including the following steps: 1, performing RTR target
drone punching on a
copper foil; 2, performing CNC drilling ona covering film; 3, attaching the
copper foil after
punching to the covering film after drilling; 4, performing press-fitting on the attached
copper foil and covering film to obtain a semi-finished product; 5, performing dry film pasting treatment,
exposure treatment, developing treatment and
etching treatment in sequence on the semi-finished product obtained in Step 4; and 6, performing coveringlayer pasting treatment on the semi-finished product after Step 5 is completed. The FPC hollowed-out circuit board preparation technology uses CNC equipment and RTR target
punching equipment to perform perforation on the covering film and the
copper foil, and then the covering film and the
copper foil are attached to each other, the circumstance that
dislocation of a printed circuit occurs in a subsequent
exposure process is overcome, and improvement of the yield of products is facilitated; and in addition, precision of hole locations in the
copper foil is high, so that a material pulling device can normally pull materials in an RTR manufacturing process, thereby ensuring long-time stable work of an FPC hollowed-out circuit board
production line.