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Polishing-free deplating solution and method for alloy base material electroplated layer deplating

A technology of stripping solution and base material, which is applied to the field of stripping and polishing-free stripping solution and stripping of electroplating coating of alloy substrates, which can solve the problems of rework and scrapping of bad blanks, flow lines of copper layer, over-corrosion and rough surface, etc.

Inactive Publication Date: 2018-08-14
XIAMEN RUNNER IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the surface treatment industry, flow lines and over-corroded rough surfaces often appear on the copper layer after stripping the chrome-nickel coating, resulting in the rework and scrapping of bad blanks, or the polishing process requires additional sanding + hemp wheel + honeycomb wheel cleaning to reach the electroplating level. superficial needs

Method used

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  • Polishing-free deplating solution and method for alloy base material electroplated layer deplating
  • Polishing-free deplating solution and method for alloy base material electroplated layer deplating
  • Polishing-free deplating solution and method for alloy base material electroplated layer deplating

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Embodiment 1

[0027] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 1:1.

[0028] The Baume degree value of the mixed solution is 48Be.

Embodiment 2

[0030] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 10:1.

[0031] The Baume value of the mixed solution is 55Be.

Embodiment 3

[0033] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 3:1.

[0034] The Baume degree value of the mixed solution is 50Be.

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Abstract

The invention relates to a polishing-free deplating solution and method for alloy base material electroplated layer deplating. The deplating solution comprises a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the volume ratio of the concentrated sulfuric acid to the phosphoric acid is (1-10):1. The product over-corrosion phenomenon can be solved, thus small parts subjected to chromium and nickel removing are directly electroplated to be reworked for using, and large parts are subjected to honeycomb wheel clearing and then reworked to be used.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a polishing-free deplating solution and a deplating method for deplating an alloy substrate electroplating layer. Background technique [0002] In the surface treatment industry, flow lines and over-corroded rough surfaces often appear on the copper layer after stripping the chrome-nickel coating, resulting in the rework and scrapping of bad blanks, or the polishing process requires additional sanding + hemp wheel + honeycomb wheel cleaning to reach the electroplating level. Superficial needs. Contents of the invention [0003] For the above-mentioned problems of the prior art, the object of the present invention is to provide a kind of electroplating coating stripping of alloy substrate without polishing and stripping solution and stripping method, which can solve the product over-corrosion phenomenon, thereby achieving small The parts can be directly electroplated and...

Claims

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Application Information

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IPC IPC(8): C25F5/00
CPCC25F5/00
Inventor 陈华辉余泽峰李容珠管建黄驰
Owner XIAMEN RUNNER IND CORP
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