Polishing-free deplating solution and method for alloy base material electroplated layer deplating
A technology of stripping solution and base material, which is applied to the field of stripping and polishing-free stripping solution and stripping of electroplating coating of alloy substrates, which can solve the problems of rework and scrapping of bad blanks, flow lines of copper layer, over-corrosion and rough surface, etc.
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Embodiment 1
[0027] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 1:1.
[0028] The Baume degree value of the mixed solution is 48Be.
Embodiment 2
[0030] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 10:1.
[0031] The Baume value of the mixed solution is 55Be.
Embodiment 3
[0033] A kind of electroplating coating stripping solution of the present invention without polishing, the coating is a copper and / or zinc alloy coating, and the stripping solution includes a mixed solution of concentrated sulfuric acid and phosphoric acid, wherein the concentrated The volume ratio of sulfuric acid and phosphoric acid is 3:1.
[0034] The Baume degree value of the mixed solution is 50Be.
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