An Integrated Device for AM, Phase Modulation, and RF Cancellation

A technology of integrated devices and phase modulators, applied in semiconductor devices, electric solid state devices, electrical components, etc., can solve the problems of unfavorable cost of various discrete devices, unfavorable to improve the quality of components, miniaturization and multi-function disadvantages, etc. It is convenient for mass production and promotion, convenient for assembly and application, and stable and reliable performance.

Active Publication Date: 2020-11-24
厚元技术(香港)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Debugging is required during assembly, which is not conducive to large-scale production and the intervention of human factors introduces uncertain factors, which is not conducive to improving the quality of the entire component;
[0005] 2. A variety of discrete devices are not conducive to further miniaturization and multi-function of the system;
[0006] 3. A variety of discrete devices are not conducive to further cost reduction

Method used

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  • An Integrated Device for AM, Phase Modulation, and RF Cancellation
  • An Integrated Device for AM, Phase Modulation, and RF Cancellation
  • An Integrated Device for AM, Phase Modulation, and RF Cancellation

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specific Embodiment

[0055] As an optimization scheme of the embodiment of the present invention, please refer to Figure 2-Figure 5 , the integrated chip includes an external interface; the external interface includes two radio frequency input circuits and two radio frequency output circuits; for the convenience of description, the two radio frequency input circuits are respectively a first radio frequency input circuit and a second radio frequency input circuit, The two radio frequency output circuits are respectively a first radio frequency output circuit and a second radio frequency output circuit. Wherein, the first radio frequency input circuit is an amplitude modulation and phase modulation circuit, the second radio frequency input circuit is a delayer A1 circuit, and the first radio frequency input circuit and the second radio frequency input circuit are respectively connected with the combiner A4 The two radio frequency input terminals are connected; in addition, the first radio frequency...

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Abstract

The invention relates to the technical field of circuit integration, and provides an integrated device for amplitude modulation, phase modulation and radio frequency cancellation, comprising an intermediate layer, a substrate located on the lower surface of the intermediate layer, and a top layer covering the upper surface of the intermediate layer; the intermediate layer Multiple functional circuits with amplitude modulation, phase modulation and cancellation are integrated by media, microstrip and discrete components; functional circuits include combiners, controllers, delayers, couplers, 2 or more amplitude modulators and 2 or multiple phase modulators, and are connected to each other in circuit design; the top layer is used to package the middle layer and shield the electromagnetic interference generated by the middle layer; the substrate is used to support the middle layer and the top layer, heat dissipation of the middle layer, and package the middle layer , and shield the electromagnetic interference generated by the middle layer. The invention integrates functional circuits with amplitude modulation, phase modulation and radio frequency offset functions into an integrated chip, which has the characteristics of small volume and high integration degree, and adopts integrated packaging technology to facilitate mass production and popularization.

Description

technical field [0001] The invention relates to the technical field of circuit integration, in particular to an integrated device for amplitude modulation, phase modulation and radio frequency cancellation. Background technique [0002] So far, with the rapid development of communication technology, the fifth-generation communication technology is constantly advancing, and the transmission system is developing rapidly in the direction of low cost, low power consumption, miniaturization, multi-function, high performance, and multi-mode. [0003] At present, the radio frequency transmission system with offset function is still widely used in communication systems due to its relatively mature technology and good performance indicators. Among them, the radio frequency integrated device is the core unit of the offset circuit, and its circuit structure includes amplitude modulators and phase modulators. , combiner, delayer, coupler and other functional circuits and devices, these ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/24
CPCH10B63/00
Inventor 孟庆南
Owner 厚元技术(香港)有限公司
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