A method of manufacturing a gold finger type printed circuit board for disconnection

Abstract

The invention discloses a method for manufacturing a disconnected gold finger type printed circuit board. The method includes the following steps: when manufacturing an outer-layer line on a production board, jointly producing a gold finger body and a gold plating lead; performing screen printing on an anti-gold plating ink on the production board, opening windows at the locations other than the disconnected location on the gold finger body, and enabling the anti-gold plating ink to form an oil bridge on the disconnected location; attaching blue glue on the production board, and opening windows on the corresponding gold finger body except the location of the oil bridge; performing thick gold plating treatment on the production board, plating a gold layer on the gold finger body; tearing off the blue glue and removing the anti-gold plating ink; coating a film on the production board, opening windows at the locations corresponding to the gold plating lead and the oil bridge, and then removing copper layers at the locations of the gold plating lead and the oil bridge by etching to form a disconnected gold finger; and then sequentially performing post-procedure processing on the production board to obtain a finished product. According to the method disclosed by the invention, by optimizing the production technical process, the quality problem caused by the screen printing of the anti-gold plating ink can be effectively avoided, and the production efficiency can be increased.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing printed circuit boards such as disconnect gold fingers. Background technique [0002] The gold finger is used for the contact between computer graphics card, memory stick, USB interface and other related equipment and other substrates. It has good wear resistance and low contact resistance, and can meet the requirements of multiple plugging and unplugging. Due to the design requirements of the interface on some circuit boards, it is necessary to set an unplated wire in the middle of the length direction of some gold fingers to cut off the gold fingers, that is, disconnect the position, and form a disconnected gold finger. In the prior art, the production process of the disconnection gold finger is as follows: normal pre-process→full board electroplating→outer layer pattern transfer→pattern electroplating→etching→coating sold...

AI Technical Summary

Problems solved by technology

In the production process of the disconnection gold finger, due to the long time of electrolytic gold, the protective effect of the anti-electrostatic gold ink is insufficient, and there will often be gold seepage at the disconnection position, resulting in irregular edges of the disconnection position, and even two parts of the disconnection position. The two gold fingers on the side are connected; in addition, in the existing process, the production process is more complicated, and the anti-electric gold ink needs to be carefully coated at the disconnection position, the production efficiency is low, and the ink will fall off if the anti-electric gold ink is not handled properly. Or the problem that the ink cannot be returned, etc.