PCB (Printed Circuit Board) manufacturing method with gold plating and gold melting processes

Abstract

The invention provides a PCB (Printed Circuit Board) manufacturing method with gold plating and gold melting processes, which comprises the following steps of: pre-processing to obtain a multi-layer circuit board with an outer-layer circuit; performing electrogilding surface treatment; removing the lead; pretreatment of gold melting: respectively carrying out oxidation resistance treatment and resistance welding on the multi-layer circuit board; carrying out chemical immersion gold surface treatment; and performing post-processing to obtain the PCB. According to the PCB manufacturing method with gold plating and gold melting processes, firstly, electrogilding surface treatment and lead removal are carried out on the multi-layer circuit board; then gold melting pretreatment is carried out;oxidation resistance treatment and resistance welding are carried out on the multi-layer circuit board; and then, chemical immersion gold surface treatment is carried out, according to the process flow, not only is the product quality of the gold plating area ensured, but also the product quality of the gold melting area is ensured, the problem of lead gold seepage during electrogilding surface treatment is more effectively solved, and meanwhile leads can be completely removed in the lead removal step.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a method for manufacturing a PCB board with gold-plating and gold-melting processes. Background technique [0002] With the continuous development of science and technology, the performance requirements for printed circuit boards are also getting higher and higher. Therefore, in order to meet the various electrical performance requirements of the PCB board, not only electroplating gold surface treatment is required during PCB board processing, but also chemical immersion gold surface treatment is required to meet the design requirements of the PCB board. And in the existing PCB board processing process with gold-plating and gold-melting process, all are to carry out gold-plating and gold-melting process again on the multi-layer circuit board that has made outer circuit and solder resist layer. However, the lead wires produced by pattern electroplating on...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the disadvantages of the existing PCB board processing process with gold plating and gold melting process, the lead wires cannot be completely removed and the gold infiltration at the lead wires leads to the short circuit lead PCB board quality, and to provide a gold plating and gold chemical process PCB board production method

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