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OLED packaging structure and OLED display panel

An encapsulation structure and encapsulation substrate technology, which can be applied in the manufacture of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve the problems of increasing the thickness of OLED display panels.

Inactive Publication Date: 2018-08-21
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

[0004] The invention provides an OLED packaging structure and an OLED display device to solve the problem that the existing OLED display panel uses inorganic materials to absorb moisture inside the OLED display panel, resulting in an increase in the thickness of the OLED packaging structure and the OLED display panel

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  • OLED packaging structure and OLED display panel
  • OLED packaging structure and OLED display panel
  • OLED packaging structure and OLED display panel

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Embodiment Construction

[0028] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0029] The present invention aims at the problem that the existing OLED display panel uses inorganic materials to absorb moisture inside the OLED display panel, resulting in an increase in the thickness of the OLED packaging structure and the OLED display panel, and proposes an OLED packaging structure and an OLED display panel. This embodiment can improve the OLED disp...

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Abstract

The invention provides an OLED packaging structure and an OLED display device. The OLED packaging structure comprises a packaging substrate and a drying layer, wherein the drying layer is arranged onthe surface of the packaging substrate and used for absorbing water oxygen; a preparation material of the drying layer is a zinc-containing metal organic framework compound in a porous structure. TheOLED packaging structure and the OLED display panel have the advantages that the preparation material of the drying layer in the packaging structure is the zinc-containing metal organic framework compound, so that the thickness of the drying layer is reduced under the premise of ensuring the moisture absorption effect of the drying layer, thereby reducing the thickness of the OLED package structure and OLED display panel.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging structure and an OLED display panel. Background technique [0002] Organic light emitting diodes (Organic Light Emitting Diode, OLED) have broad application prospects in the display market due to the advantages of self-luminescence, low driving voltage, and high luminous efficiency. Different from traditional display technologies, OLED display devices do not require a background light source, and different colors of light can be obtained by applying voltage to different organic material coatings. [0003] Organic light-emitting materials are very easy to react with water and oxygen, resulting in material deactivation. Therefore, the requirements for OLED display panels are: the water vapor transmission rate is lower than 10 -6 grams / square meter / day, improving the structure of the OLED display panel to block water and oxygen is very important for maintaining t...

Claims

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Application Information

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IPC IPC(8): H01L51/52
CPCH10K50/846H10K50/841
Inventor 彭哲玮
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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