Substrate-to-substrate broadband interconnection structure

Abstract

The invention discloses a substrate-to-substrate broadband interconnection structure. The broadband interconnection structure comprises a first substrate and a second substrate arranged on one side ofthe first substrate, the first substrate is provided with a first microstrip line and a first port, the second substrate is provided with a second microstrip line and a second port, the first port and the second port are connected through a gold wire bonding wire, the broadband interconnection structure further comprises a first open-circuit line arranged on the first substrate and a second open-circuit line arranged on the second substrate, the first open-circuit line is connected with the first port, and the second open-circuit line is connected with the second port; a first defect ground structure is arranged at the corresponding position on the first substrate under the first open-circuit line and used for improving the characteristic impedance of the first microstrip line; a second defect ground structure is arranged at the corresponding position on the first substrate under the second open-circuit line and used for improving the characteristic impedance of the second microstripline, and the first defect ground structure and the second defect ground structure are not communicated. According to the broadband interconnection structure, the overall structure is simple, and thecharacteristic impedance of the microstrip lines is improved.

Description

technical field [0001] The invention relates to the field of electronic structure design, in particular to a substrate-to-substrate broadband interconnection structure. Background technique [0002] The interconnection structure is used in monolithic microwave integrated circuits and multi-chip modules to realize signal transmission between substrates of different heights, such as Figure 6 As shown, one substrate is superimposed on another substrate, and then the interconnection between the substrates is realized through the connection of gold wire bonding wires, but the traditional interconnection between substrates has the following problems: First, the use of multiple gold wire bonding wires And the compensation microstrip open line can effectively increase the bandwidth of the interconnect structure, but the frequency cannot exceed 20 GHz; second, the minimum width required for the compensation open line used to widen the bandwidth of the gold wire bonding interconnect s...

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Problems solved by technology

[0002] The interconnection structure is used in monolithic microwave integrated circuits and multi-chip modules to realize signal transmission between substrates of different heights, such as Image 6 As shown, one substrate is superimposed on another substrate, and then the interconnection between the substrates is realized through the connection of gold wire bonding wires, but the traditional interconnection between substrates has the following problems: First, the use of multiple gold wire bonding wires And the compensation microstrip open line can effectively increase the bandwidth of the interconnect structure, but the frequency cannot exceed 20 GHz; second, the minimum width required for the compensation open line used to widen the bandwidth of the gold wire bonding interconnect structure is less than 0.1 mm, and this width It is difficult to achieve in the existing printed circuit board and low temperature co-fired ceramic manufacturing process

[0003] At the same time, in many practical applications, in order to transmit signals better, it is necessary to use multiple substrates, such as the following two cases: First, for better signal transmission, the local oscillators of the transmitter, receiver and transceiver Parts must be highly isolated. Therefore, these three parts need to design separate circuit substrates to avoid signal leakage through the common substrate, especially high-power local oscillator leakage; second, in many practical cases, it cannot be realized in a circuit All components are placed on the substrate, so in complex circuits, they can only be placed on different circuit substrates

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