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Heat sink and light emitting structure

A technology of heat dissipation device and light-emitting structure, which is applied in the direction of lighting devices, cooling/heating devices of lighting devices, semiconductor devices of light-emitting elements, etc., and can solve problems such as short life, serious heat dissipation problems, and service life of less than 20,000 hours

Active Publication Date: 2019-12-13
东莞市闻誉实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as the amount of LEDs increases, the problem of heat dissipation is more serious. The problem of heat dissipation of LEDs is now more and more valued by people. This is because the light decay or life of LEDs is directly related to its junction temperature, and the heat dissipation is not good The higher the temperature, the shorter the lifespan. According to the Arrhenius law, the lifespan will be extended by 2 times for every 10°C decrease in temperature.
Under normal circumstances, if the junction temperature can be controlled at 65°C, the life of LED products with light decay to 70% can be as high as 100,000 hours, but in fact, the use environment of LEDs often cannot provide better heat dissipation conditions, which leads to LED The service life of some integrated high-power LED lighting devices is often less than 20,000 hours, and the service life of some LED lighting devices is even less than 5,000 hours.
[0004] In the traditional design, considering that the efficiency of heat conduction is higher than that of heat convection, it is often designed to fit the mounting plate and the metal heat sink, and design a large number of heat sinks on the heat sink extension, so that on the one hand, the heat sink is too large and heavy The problem of consuming metal materials. On the other hand, since the heat sink is often a thin metal sheet, there are certain safety hazards in processing, transportation, installation and use.

Method used

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  • Heat sink and light emitting structure
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  • Heat sink and light emitting structure

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Embodiment Construction

[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0021] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly co...

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Abstract

The invention relates to a heat dissipation device and a light emitting structure. The heat dissipation device comprises a base, strengthening pieces, a support column, a first supporting piece, a second supporting piece, a heat dissipation piece, a first auxiliary heat dissipation plate, a second auxiliary heat dissipation plate, a third auxiliary heat dissipation plate and an installing plate. The support column is fixed to the base, and the strengthening pieces surround the support column and are connected with the support column and the base. The first supporting piece is arranged on the support column through a connecting piece. The second supporting piece is arranged on the first supporting piece through a connecting piece. The heat dissipation piece is arranged on the second supporting piece through a connecting piece. The first auxiliary heat dissipation plate is arranged on the heat dissipation piece. The second auxiliary heat dissipation plate is arranged on the first auxiliary heat dissipation plate through a connecting piece. The third auxiliary heat dissipation plate is arranged on the second auxiliary heat dissipation plate through a connecting piece. The installing plate is arranged on the third auxiliary heat dissipation plate through a connecting piece. The side face, away from a sixth connecting piece, of the installing plate is used for installing a heat source. The heat dissipation device has the beneficial effects that few materials are adopted, and the heat dissipation effect is good.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat dissipation device and a light emitting structure. Background technique [0002] Light-emitting diodes, referred to as LEDs for short, are made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), and the like. Visible light can be radiated when electrons and holes recombine, so they can be used to make light-emitting diodes. It is used as an indicator light in circuits and instruments, or as a text or number display. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to chemical properties, it is divided into organic light-emitting diode OLED and inorganic light-emitting diode LED. The reason why LED has been widely valued and developed rapidly is inseparable from its own advantages. These advantages are summarized as fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V29/71F21Y115/10
CPCF21K9/20F21V29/71F21Y2115/10
Inventor 叶伟炳
Owner 东莞市闻誉实业有限公司