Cutting method and application method of high-temperature protective film for bonding

Abstract

The invention discloses a cutting method and an application method of a high-temperature protective film for bonding and relates to the technical field of integrated circuit packaging. The cutting method of the high-temperature protective film for bonding comprises the steps that firstly, a flat sheet iron plate is prepared; secondly, a blue film for scribing is smoothly pasted to the sheet iron plate; thirdly, the high-temperature protective film needing to be cut is smoothly pasted to the blue film for scribing; fourthly, the sheet iron plate pasted with the blue film and the high-temperature protective film is put at the position to be scribed of a scribing machine; fifthly, the position of a blade of the scribing machine is adjusted or the parameters of the scribing machine are set; and sixthly, the high-temperature protective film is cut into 1.5*1.5 mm or 2.0*2.0 mm square blocks. The application method of the high-temperature protective film for bonding comprises the steps thatfirstly, before pasting, grooves are checked; secondly, the cut high-temperature protective films are put into the grooves of a heating bottom plate of an integrated circuit; and thirdly, the high-temperature protective films are smoothly pasted to the grooves. According to the film cutting method, operation is easy, and the speed is high; and the film cutting effect is good, and the problems of burrs, inconsistent sizes and the like do not exist.

Description

technical field [0001] The invention relates to a cutting method and a using method of a high-temperature protective film for bonding, and belongs to the technical field of integrated circuit packaging. Background technique [0002] Before the bonding operation of the integrated circuit packaging process, due to the gap between the lead frame and the equipment bottom plate, the product quality is affected during the bonding and the output rate of the equipment is low, so it is necessary to carry out the heating block groove of the bonding base. Film sticking is widely used in bonding process SOP16-8R(60*60), SOP8-8R(60*60) and other small PAD area products. In the past, the manual cutting of the film had the following disadvantages: [0003] 1. The cutting speed is slow. It is necessary to manually cut a piece of film into small squares of about 1.5mm~3.0mm, which usually takes 30 minutes to 1 hour; [0004] 2. The cutting effect is poor, the square to be cut is only about...

AI Technical Summary

Problems solved by technology

[0003] 1. The cutting speed is slow. It is necessary to manually cut a piece of film into small squares of about 1.5mm~3.0mm, which usually takes 30 minutes to 1 hour;

[0004] 2. The cutting effect is poor, the square to be cut is only about 2mm, the size cannot be grasped manually, the size is inconsistent, and the blade is worn out, resulting in burrs on the edge of the square

[0005] 3. The high temperature protective film wears a lot. If you cut a piece of film by hand, usually 20%~40% of the area cannot be used.

Not only can it not improve the first welding aspects such as ball extrusion and non-sticking from other aspects, but also can not meet the requirements while reducing the UPH of the machine

In addition, it is also difficult to process small PAD products; in actual production, it is impossible to process without relying on the film

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