Machining method for multi-straight slit assembly for onboard high-spectral resolution spectrograph

Abstract

The invention discloses a machining method for a multi-straight slit assembly for an onboard high-spectral resolution spectrograph. Two first blade bodies with single blades and a plurality of secondblade bodies with double blades are provided. The first blade bodies are distributed on the two sides, the second blade bodies are arranged between the two first blade bodies side by side, and finallythe side-by-side multi-slit assembly is spliced. The machining method of each second blade body comprises the following steps that lapping and step-by-step polishing are carried out on the bottom face of the second blade body, and with the bottom face of the second blade body as a standard, the cutting edge end face of the second blade body is subjected to lapping; the second blade is detected; the qualified second blade body in detection is installed on an oblique face grinding tool, the two oblique faces of the second bade body are subjected to lapping and polishing, and the thickness of the cutting edge end face of the second blade body is controlled within 0.03 mm-0.04 mm; final recheck is carried out on the second blade body, and machining of each second blade body is completed according to the machining method; and the first blade bodies and the second blade bodies are spliced into the whole multi-slit assembly under a tool microscope.

Description

technical field [0001] The invention relates to the technical field of spectrometers, in particular to a processing method for multi-straight slit components used in airborne high spectral resolution spectrometers. Background technique [0002] The airborne high spectral resolution spectrometer divides the large field of view through the fiber optic image splitter, and then respectively imports the subfields of view into the multi-slits of the spectrometer. On the sensor, and then realize ultra-large field of view hyperspectral imaging detection. This multi-slit field of view splicing technology expands the spatial size of the area array detector and reduces the demand for detectors for large field of view data acquisition. The core of this field of view stitching technology is the preparation of multiple slits. [0003] At present, for the processing of multi-straight slits, the more mature technologies are mainly MEMS processing technology, wire electric discharge proces...

AI Technical Summary

Problems solved by technology

Considering that laser processing will cause deformation of the slit blade body, it is difficult to guarantee a processing accuracy of 1 μm

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