Electrolyte solution, electrolytic copper foil and manufacturing method thereof

Abstract

The invention discloses an electrolyte solution, electrolytic copper foil and manufacturing method thereof. The electrolyte solution is used for manufacturing the electrolyte copper foil, and containscopper ions of 50 to 90 g / L, sulfuric acid of 50 to 120 g / L and Cl ions of a concentration of not higher than 1.5 ppm. The electrolytic copper foil manufactured after the abovementioned electrolyte solution is electrolyzed has ten-point average roughness of not higher than 2 [mu]m on a surface at one side which is in contact with the electrolyte solution, the electrolytic copper foil has an elongation difference value generated through thermal treatment, and the elongation difference value is negatively correlated with an initial grain size of the electrolytic copper foil. The electrolytic copper foil provided by the invention has low roughness and special mechanical property, and can be applied to an electrical assembly.

Description

technical field [0001] The present invention relates to an electrolytic solution, an electrolytic copper foil and a manufacturing method thereof, in particular to an electrolytic solution for manufacturing an electrolytic copper foil with low roughness, an electrolytic copper foil manufactured by using the electrolytic solution and a manufacturing method thereof. Background technique [0002] In recent years, due to the increasing mounting density and miniaturization of printed wiring boards, reducing the volume inside the equipment has become a problem. In order to be able to cope with fine circuits with higher density of wires, it is necessary to use low-thickness copper foil. [0003] Patent Document 1 (Japanese Patent Laid-Open Publication No. 2005-154815) provides a copper electrolyte solution for producing electrolytic copper foil and a method for producing electrodeposited copper foil using the copper electrolyte solution, which are not substantially affected by the m...

AI Technical Summary

Problems solved by technology

[0006] Since the concentration of additives is difficult to detect, the preparation of electrolytic copper foil with low roughness by the above process will cause difficulties in process management

And in the manufacturing process, the accumulation of additives needs to be removed by a large amount of activated carbon filtration, which increases the difficulty of management, environmental concerns and cost considerations

However, without the use of additives in the copper electrolyte, the roughness of the as-prepared electrolytic copper foil would be greatly increased

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