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Cutting method of workpiece

A technology of processed objects and cutting methods, applied in the direction of stone processing tools, stone processing equipment, work accessories, etc., can solve the problems of increased processing time, incomplete cutting, and inability to be divided by processed objects, so as to increase processing time Effect

Active Publication Date: 2018-09-14
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the size of the workpiece input to the control unit by the operator is smaller than the actual size, before the cutting tool completes cutting on a planned dividing line, under the control of the control unit, the cut is cut by the cutting feed unit. The tool is lifted from the workpiece, and the cutting tool is indexed to start cutting the next planned dividing line. Therefore, the cutting process from one end of the planned dividing line to the other end with the cutting tool may not be complete. carried out, so that the workpiece cannot be completely divided
In addition, when the outer shape of the workpiece input to the control unit by the operator is larger than the actual size, after the cutting tool completes cutting from one end to the other end of the planned division line of the workpiece, the Machining time is wasted due to cutting of areas without workpieces
[0006] Therefore, in the cutting method of the workpiece, there is a problem that even when the processing conditions are set such that the outer shape of the workpiece is smaller than the actual size, the following situation is eliminated due to the cutting process of the cutting tool. Cutting ends in an incomplete state because it does not proceed reliably from one end to the other end of the planned dividing line of the workpiece; When the size is larger than the actual size, the following situation is also eliminated: after the cutting tool completes the cutting of the workpiece, the area without the workpiece is cut in vain and the extra processing time is increased.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0032] Below, use figure 1 A method of cutting the workpiece W by the cutting device 1 shown will be described. For example, first, the operator inputs the processing conditions determined based on the size of the workpiece W to the control unit 9 . Then, the cutting device 1 is set in a state where the control unit 9 controls each device component in accordance with the machining conditions. That is, the cutting feed distance of the chuck table 10 realized by the cutting feed unit 12 , the predetermined plunging height position of the cutting tool 110 positioned by the plunging feed unit 14 , and the like are set.

[0033] (1) Hold step

[0034] First, follow the figure 1 The workpiece W is placed on the holding surface 100 a so that the center of the chuck table 10 shown substantially coincides with the center of the workpiece W with the side of the dicing tape T facing downward. Then, the suction force generated by the suction source (not shown) is transmitted to the ho...

Embodiment approach 2

[0052] Below, use figure 1 A method of cutting the workpiece W by the cutting device 1 shown will be described.

[0053] (1) Hold step

[0054] By carrying out the holding step in the same manner as in Embodiment 1, the workpiece W is sucked and held by the chuck table 10 , which is the back surface Wb of the workpiece W opposite to the workpiece surface Wa.

[0055] (2) Processing steps

[0056] Next, by performing the processing step in the same manner as in Embodiment 1, cutting is performed on the processed surface Wa of the workpiece W, and the cutting tool 110 first cuts into the dicing tape T around the workpiece W while rotating at a high speed, and only A prescribed distance is cut on the dicing tape T.

[0057] (3) Reduction rate detection steps

[0058] The load current value detection unit 15 starts to detect the load current value of the electric power supplied to the motor 115 first in the processing step. For example, when the cutting tool 110 is cutting on...

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Abstract

A cutting method of a workpiece is provided, wherein cutting operation of a cutter to the workpiece will not finish in an incomplete status, and increase of residual processing time since the cutter processes a zone in which the workpiece does not exist can be avoided. The cutting method of the workpiece (W) is to cut the workpiece by means of a cutting unit (11), which has a main shaft (111) andthe cutter (110), along a predetermined segmenting line (S) and includes the following steps: holding the workpiece on a work bench (10); rotating the cutter relative to the workpiece held on the workbench and determining a cutting position so that the work bench and the cutter can move relatively in a cutting feeding direction at a specified speed, thus cutting the workpiece; detecting load current value of a motor (115), which performs rotation drive to the main shaft, during the processing step, and if the detected load current value is lower than a threshold, determining the workpiece hasbeen cut apart in the cutting feeding direction.

Description

technical field [0001] The present invention relates to a cutting method of workpieces such as semiconductor wafers. Background technique [0002] A workpiece such as a semiconductor wafer is divided into individual device chips along planned dividing lines by a cutting device having a cutting unit rotatably mounted with a cutting blade (for example, see Patent Document 1), and used in various electronic devices. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2009-283604 [0004] When using the above-mentioned cutting device to perform cutting processing on a workpiece, the operator inputs information such as the size of the workpiece from the input unit to the control unit of the cutting device in advance, and the control unit controls the cutting unit, cutting feed unit, etc. according to the information. The movement of each structural element of the device is controlled to perform precise cutting on the workpiece. [0005] However, when the size of the workp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/22B28D7/00
CPCB28D1/22B28D7/005H01L21/78H01L21/76H01L21/67092H01L21/67242
Inventor 车柱三
Owner DISCO CORP