Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heating assembly, packaging device and packaging method

A technology for heating components and packaging methods, applied in chemical instruments and methods, lamination devices, electrical components, etc., can solve problems such as insufficient diffusion of filling glue, damage to sealant, air bubbles, etc. Damage and defects, the effect of reducing viscosity

Active Publication Date: 2018-09-14
BOE TECH GRP CO LTD +1
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, embodiments of the present invention provide a heating assembly, a packaging device, and a packaging method. By rationally designing the light emitting type of the light source assembly, the first light is used to heat the first adhesive material, and the second light is used to cure the second light. The second adhesive material solves the problem of air bubbles caused by insufficient diffusion of the filler in the existing packaging technology, and at the same time solves the problem of damage and defects caused by the impact of the sealant on the filler

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heating assembly, packaging device and packaging method
  • Heating assembly, packaging device and packaging method
  • Heating assembly, packaging device and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] In order to make the purpose, technical solution and advantages of the present invention more clear, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0045] The following specific embodiments provided by the present invention can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0046] figure 1 A schematic structural diagram of a heating assembly provided by an embodiment of the present invention. The heating assembly 100 provided in this embodiment is used to heat the package of the DAM&FILL structure to achieve the purpose of effective packaging. The heating assembly 100 may include: a light source assembly 110 .

[0047] Wherein, the light source assemb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An embodiment of the invention discloses a heating assembly, a packaging device and a packaging method. The heating assembly is used for heating and curing a package, and comprises a light source assembly for emitting first light for heating a first glue material in a first area of the package and emitting second light for curing a second glue material in a second area of the package, and the package is an assembly for packaging an electronic device. According to the embodiment, the light emitting type of a light source assembly is reasonably designed, the first glue material is heated by thefirst light, the second glue material is cured by the second light, the problem of air bubbles caused by insufficient diffusion of the filling glue in the conventional packaging technology is solved,and the problems of damage and defects caused by impact of frame sealing glue with the filling glue are also solved.

Description

technical field [0001] The present application relates to but not limited to the field of display technology, especially a heating assembly, packaging device and packaging method. Background technique [0002] With the development and mass production of electronic components, the packaging technology also develops accordingly. Organic Electroluminance Display (OLED) is usually packaged with DAM&FILL packaging technology. [0003] In the existing DAM&FILL packaging technology, there are two problems: one is the bubble problem caused by the insufficient diffusion of the filler (FILL), and the other is the impact of the diffusion of the filler (FILL) on the sealant (DAM), which will lead to The frame glue is damaged and defective. The above-mentioned packaging technology of DAM&FILL is contradictory to the improvement method of avoiding bubbles in the filling glue and avoiding damage to the sealing glue. If you want to avoid the bubbles of the filler, you need to reduce the v...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L51/52
CPCH01L21/67115H10K50/841H10K50/8426H01L21/67126B32B37/06B32B37/12B32B37/1207B32B37/1292B32B37/144B32B2037/1253B32B2457/206H10K71/00
Inventor 任锦宇宋勇志周波
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com