Method for plating nickel gold on circuit of printed circuit board and circuit of printed circuit board

Abstract

The invention discloses a method for plating nickel gold on the circuit of a printed circuit board and the circuit of the printed circuit board. The method comprises the steps of covering a first photosensitive anti-plating layer on a base copper layer of a substrate, using a pattern file to expose, and developing to remove the unexposed first photosensitive anti-plating layer to expose the base copper layer; covering a second photosensitive anti-plating layer on the first photosensitive anti-plating layer, using the pattern file to expose, and developing to remove the unexposed second photosensitive anti-plating layer; plating copper on the exposed base copper layer, wherein the copper plated layer is higher than the top surface of the first photosensitive anti-plating layer; removing thesecond photosensitive anti-plating layer; plating nickel gold on the copper plated layer to form a nickel gold layer coated copper plated layer; removing the first photosensitive anti-plating layer;and etching to remove the base copper layer to form the circuit of the printed circuit board. According to the method provided by the invention, the copper plated layer is semi-wrapped by the finishednickel gold layer, line edge collapsing is prevented from occurring in the protruded edge structure, and both the copper plated layer and the nickel gold layer are conducted via the base copper layer, the current is distributed uniformly, and the circuit accuracy is ensured.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for electroplating nickel-gold on a printed circuit board circuit and the printed circuit board circuit thereof. Background technique [0002] Nickel-gold electroplating is one of the commonly used surface treatment processes for printed circuit boards. The traditional nickel-gold electroplating process is generally: first paste a layer of photosensitive anti-plating layer on the substrate, and then use negative film or LDI to expose the pattern on the anti-plating layer, and then Use liquid medicine to remove the unexposed anti-plating layer to expose the base copper, then electroplate copper and nickel gold on the exposed base copper, finally remove the anti-plating layer, and etch the base copper under the anti-plating layer. In the traditional nickel-gold electroplating process, while etching the base copper under the anti-plating layer, t...

AI Technical Summary

Problems solved by technology

However, the process is limited by graphics. When the graphics are complex, the plating wires are difficult to remove, and there is a problem of process wire residue; and through electroplating with gold-plated wires, the current distribution is uneven, resulting in uneven plating and low line width accuracy.

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