Antenna and fabrication method thereof

Abstract

The embodiment of the invention provides an antenna and a fabrication method thereof, and relates to the field of glass substrate antenna fabrication. By the antenna and the fabrication method thereof, the purposes of adjusting a resistance value of a glass substrate patch antenna on the basis of arranging a variable inductor and a variable capacitor without punching is achieved. The antenna comprises a first substrate, a second substrate, a first antenna electrode, a second antenna electrode, a microstrip line and a liquid crystal layer, wherein the first substrate and the second substrate are opposite to each other, the first antenna electrode is arranged at one side, far away from the second substrate, of the first substrate, the second antenna electrode is arranged at one side, far away from the first substrate, of the second substrate, the microstrip line is arranged at one side, near to the first substrate, of the second substrate, the liquid crystal layer is arranged between thefirst substrate and the second substrate, at least one driving electrode assembly is arranged between the first substrate and the second substrate, the driving electrode assembly is configured to adjust impedance of the antenna by controlling liquid crystal molecule deflection of the liquid crystal layer, and positive projection of the first antenna electrode on the second substrate and positiveprojection of the microstrip line on the second substrate are at least partially overlapped.

Description

technical field [0001] The invention relates to the field of patch antenna manufacture, in particular to an antenna and a manufacturing method thereof. Background technique [0002] The patch antenna on the surface of the glass substrate can be made by pasting the copper skin, but the echo will be caused if the pasting accuracy is not perfect. In order not to make the pasting process too difficult, technicians need to find a way to adjust the impedance of the patch antenna after the antenna patch is pasted, so that it can still achieve a matching state when there is an error in the paste, reducing the echo and Lower SWR. In the prior art, if the problem of imperfect bonding accuracy is to be overcome, a variable inductance and a variable capacitance are connected between the antenna microstrip line and the ground electrode to achieve the purpose of adjusting the impedance and reducing the standing wave ratio . However, if you want to make a patch antenna with the above me...

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Problems solved by technology

However, if you want to make a patch antenna with the above method when making a glass substrate antenna, you can obviously find that the connection of the variable inductance and variable capacitance on the glass substrate is more difficult than the traditional PCB (Printed Circuit Board, printed circuit board). board) should be high; for example, glass cannot be drilled and connected arbitrarily like a PCB, which will make it difficult for integrated electronic chips or passive components to be combined with glass

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