Printed circuit board manufacturing method and printed circuit board

A technology of printed circuit board and manufacturing method, applied in the field of electronics, can solve the problems of high cost, inapplicability of high-level boards, complicated process flow, etc.
CN108617097BActive Publication Date: 2020-09-18SOUTH CHINA UNIV OF TECH +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SOUTH CHINA UNIV OF TECH
Publication Date
2020-09-18

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Abstract

The invention relates to a manufacturing method for a printed circuit board and the printed circuit board. The manufacturing method comprises the following steps: respectively drilling a first sub-board and a second sub-board; respectively drilling the first sub-board and the second sub-board; carrying out the electroplating of the holes drilled in the sub-board and the second sub-board to obtainelectroplated holes; performing the back drilling of short columns generated by electroplating of the holes in the first sub-board and the second sub-board, and obtaining back holes; and carrying outthe stitching of the first sub-board and the second sub-plate to form a mother board. The printed circuit board is fabricated using the method as described above. Through the above-mentioned manufacturing method, the hole depth of a back drilling hole of a PCB product with the thickness of 10 mm or less can be controlled to be 8 mil, which greatly improves the impedance continuity of the via holeand improves the transmission loss of the via hole. Moreover, the method has a simple process flow and is compatible with a conventional PCB process.
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Description

technical field

[0001] The invention relates to the field of electronic technology, in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique

[0002] With the development of communication technology, the number of layers of PCB (Printed Circuit Board, printed circuit board) is getting higher and higher. At present, the number of layers of high-end communication products has reached 60 layers, which brings great challenges to PCB processing. At the same time, with the development of 5G and the Internet of Things, the backbone communication rate will increase to 400G, and the corresponding PCB single-channel rate will increase to 56G.

[0003] With the continuous improvement of PCB data transmission rate, the influence of PCB process control on signal transmission is becoming more and more prominent. The main factors affecting PCB signal integrity In addition to design and PCB materials, vias also have a greater i...

Claims

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