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cutting device

A technology of cutting device and cutting tool, which is applied in the direction of automatic grinding control device, grinding/polishing safety device, device for fixing grinding wheel, etc., which can solve the problems of flange chip pollution, difficulty in distinguishing, distraction of operators, etc.

Active Publication Date: 2021-11-23
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, as the machining continues, the flange may be contaminated with cutting chips and become difficult to distinguish, or if the operator is distracted, the identification by color may be ignored

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0033] A cutting device according to Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 It is a perspective view showing a configuration example of the cutting device according to the first embodiment.

[0034] The cutting device 1 according to Embodiment 1 is a device for cutting a workpiece 201 . In Embodiment 1, the workpiece 201 is a disk-shaped semiconductor wafer or an optical device wafer having silicon, sapphire, gallium, or the like as a base material. In the workpiece 201 , devices 204 are formed on the front surface 202 in regions divided in a grid pattern by a plurality of planned division lines 203 formed in a grid pattern. The workpiece 201 of the present invention may be a so-called TAIKO wafer in which the central portion is thinned and a thick portion is formed on the outer periphery. In addition to a wafer, the workpiece 201 may also be a rectangular shape having a plurality of resin-sealed devices. Packaging su...

Embodiment approach 2

[0080] A cutting device according to Embodiment 2 of the present invention will be described with reference to the drawings. Figure 17 It is a perspective view showing a cutting tool and a container attached to the cutting unit of the cutting device according to the second embodiment. Figure 17 In , the same parts as those in Embodiment 1 are denoted by the same reference numerals, and explanations thereof are omitted.

[0081] The cutting device 1 of the second embodiment is the same as the first embodiment except that the releasable sticker 70 for specifying the type of the cutting tool 21 is pasted (installed) on a predetermined portion of the supporting base 211 of the cutting tool 21 . The reading unit 80 of the cutting device 1 according to Embodiment 2 reads the barcode 71 of the releasable label 70 provided on the cutting blade 21 .

[0082] In the cutting device 1 of the second embodiment, as in the first embodiment, the cutting tool 21 is attached to the main shaf...

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PUM

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Abstract

A cutting device is provided which enables the cutting tool to be attached to the main shaft without confusing the type of the cutting tool attached to the main shaft. The cutting device has: a first cutting unit and a second cutting unit (20-1), (20-2) having a tool cover fixed to the main shaft housing; a chuck table (10) for holding a workpiece (201) ); and a control unit (100) including a tool information registration unit (101) that registers types of cutting tools. The tool cover has a movable portion that can be selectively positioned in an approach position and a separation position. When the type of the first cutting tool is registered, the control unit (100) only sets the movable part of the tool cover of the first cutting unit (20-1) at the separated position, and when the type of the second cutting tool is registered , the control unit (100) only sets the movable part of the cutter cover of the second cutting unit (20‑2) at the disengaged position.

Description

technical field [0001] The present invention relates to a cutting device for cutting a workpiece. Background technique [0002] There is known a cutting device (dicing machine) that divides various plate-shaped workpieces such as semiconductor wafers and resin package substrates by using cutting blades. As the cutting device, a biaxial type cutting device capable of simultaneously cutting two planned dividing lines having two cutting units constituted by main shafts on which a cutting tool is mounted is used. This biaxial cutting device implements efficient cutting. [0003] The known biaxial cutting device implements step cutting, and different types of cutting tools are installed on each main shaft. The cutting tool installed on one main shaft has a thicker blade thickness, forming a metal or functional layer on the front surface of the workpiece. A cutting tool mounted on the other spindle has a thin blade thickness, and performs full cutting on the groove bottom of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/06B24B27/00B24B51/00B24B55/04B24B41/06B24B57/02B24B45/00B24B41/00
CPCB24B27/0076B24B27/06B24B41/00B24B41/06B24B45/006B24B51/00B24B55/04B24B57/02Y02P70/10H01L21/67092H01L21/67051H01L21/67242
Inventor 田中英明宫田谕
Owner DISCO CORP