A contact type semiconductor material testing head

Abstract

The invention discloses a contact-type semiconductor material testing head, which comprises a housing and a probe combination arranged in the housing; the probe combination includes a flat tension spring and a probe, and the two sides of the flat tension spring are symmetrical, including a lower spring end And the extension end of the upper part, the probe is fixed in the center of the spring end, and the extension end is a hollow flat plate; there are multiple flat extension springs, and the plurality of flat extension springs are overlapped together, and the extension ends of the flat extension springs are set in the housing. The spring end of the extension spring is arranged at the lower part of the housing, and an insulating film isolating layer is arranged between two adjacent flat extension springs. In the middle part, a vertical slot is arranged in the center of the middle part, and the probe is arranged in the slot. The invention completely eliminates the lateral force, has a simple structure and few parts, can greatly reduce the distance between the probes, reduces the negative impact of the edge effect on the overall test accuracy during the test, and has high test accuracy, low cost and long service life.

Description

technical field [0001] The invention relates to the technical field of semiconductor material testing, in particular to a contact-type semiconductor material testing head with simple structure, high testing precision, small probe spacing, low cost and long service life. Background technique [0002] In the existing contact semiconductor test head, in addition to the electrical circuits arranged inside, the main elements of the test head are composed of probes and springs. Because the distance between the probes of the semiconductor test head is very small, and the space for arranging the corresponding mechanism is limited, a cantilever compression spring is generally used to exert force on the probe, or a lever is extended to exert force on the probe indirectly. The lateral force caused by this type of structure causes the probe to form additional friction in the guide bearing. This friction will have a discrete impact on the accuracy of the pressure due to materials, manufa...

AI Technical Summary

Problems solved by technology

The lateral force caused by this type of structure causes the probe to form additional friction in the guide bearing. This friction will have a discrete impact on the accuracy of the pressure due to reasons such as material and manufacturing, so that the probe and the measured There is uncertainty interference in the actual contact pressure of the surface, and the upper and lower envelopes of the pressure have a large area, so that the probe pressure reproducibility cannot achieve high accuracy whether it is static or dynamic, thus affecting the test results.

However, using the helical compression spring to directly apply force to the probe has difficulties in structural layout; if the pressure of the probe is directly adjusted, it will be difficult to reduce the distance between the probes, so it is rarely used in the field of semiconductor testing.

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