Intelligent foam metal reinforced boiling heat transfer cooling device

Abstract

The invention provides an intelligent foam metal reinforced boiling heat transfer cooling device. The intelligent foam metal reinforced boiling heat transfer cooling device comprises a sealing cavity(5), wherein the sealing cavity (5) is filled with a refrigeration fluid (2); a bottom intelligent foam metal (3) is fixed on the inner surface of the bottom of the sealing cavity (5) and is immersedinside the refrigeration fluid (2); a top foam metal (7) is fixed on the inner surface of the top of the sealing cavity (5); a guide pipe (5) is arranged at the upper end of the side surface of the sealing cavity (5); a draught fan (1) is arranged on the outer surface of the top of the sealing cavity (5). The bottom intelligent foam metal (3) has a whole memory effect, and the porosities and poresizes of the foam metals change along with temperature. According to the cooling device provided by the invention, boiling heat transfer is reinforced by using the intelligent foam metals, the evaporation core and heat transfer areas are increased, the flow resistance is also reduced, and the escape speed of bubbles is increased effectively, so that the heat transfer quantity is obviously increased, and the cooling capacity is greatly strengthened.

Description

technical field [0001] The invention relates to an intelligent foam metal enhanced boiling heat exchange cooling device, which belongs to the technical field of heat exchange. Background technique [0002] With the rapid development of microelectronics technology, the degree of integration of electronic chips is high, the speed of operation is faster, and the performance is rapidly improved. Therefore, the heat flux increases and the power increases accordingly, and the subsequent heating problem becomes more and more serious. The problem of heat dissipation has become one of the restrictive factors for the development of the microelectronics industry; at the same time, for the sudden increase in power and the sudden rise in temperature of the chip, the current heat dissipation device cannot respond in time to quickly dissipate heat. Optimizing the cooling device of electronic equipment and reducing the temperature of key components is of great significance to prolonging the...

AI Technical Summary

Problems solved by technology

[0005] Although the above patents have improved the heat dissipation effect of the cooling device, there are still deficiencies: the increase in the pores of the metal foam will reduce the heat transfer area and thermal conductivity, and the decrease in the pores will increase the flow resistance of the air bubbles. It is difficult to find a way to achieve both. The potential of heat exchange has not been fully utilized, and there is currently no good solution to the problem of sudden temperature rise of the chip

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