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Differential signal transmission line and signal transmission system for high frequency

A differential signal and transmission line technology, applied in the field of differential signal transmission lines, can solve the problems of complicated IC manufacturing process and large transmission line area

Active Publication Date: 2021-05-04
ANRITSU CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, CPW needs to provide a ground conductor between a pair of signal conductors, and there is a problem that the area of ​​the entire transmission line becomes larger
On the other hand, in a microstrip line, a small line can be realized by forming a signal conductor and a ground conductor (GND plane) facing it from two layers of conductors sandwiched by an insulating layer on the surface of the IC. However, for example, in order to obtain In order to reduce the capacitive component between the signal conductor and the GND plane, the insulating layer sandwiching the two conductors must be formed with a thickness of several μm or more. Therefore, there is a problem that the IC manufacturing process becomes complicated.

Method used

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  • Differential signal transmission line and signal transmission system for high frequency
  • Differential signal transmission line and signal transmission system for high frequency
  • Differential signal transmission line and signal transmission system for high frequency

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0065] Such as figure 1 and figure 2 As shown, the differential signal transmission line 1 serving as the high-frequency differential signal transmission line according to the first embodiment of the present invention is the following ECCPW, which includes: The first signal conductor 11 and the second signal conductor 12 of the conductor; the first ground conductor 13 formed on the side of the first signal conductor 11 on the substrate 100; and the first ground conductor 13 formed on the side of the second signal conductor 12 on the substrate 100 The second ground conductor 14.

[0066] The substrate 100 is, for example, a semiconductor substrate made of InP (indium-phosphorus), GaAs (gallium-arsenic), or Si (silicon). The signal conductors 11 , 12 and the ground conductors 13 , 14 are formed of conductive layers suitable for use as metals for high-frequency signal transmission, such as Cu (copper) and Au (gold). In addition, the ground conductors 13 and 14 may be at leas...

no. 2 Embodiment approach

[0114] Next, a differential signal transmission line 2 as a high-frequency differential signal transmission line according to a second embodiment of the present invention will be described with reference to the drawings. The same components as those of the differential signal transmission lines 1, 1' according to the first embodiment are denoted by the same reference numerals and detailed description thereof will be omitted.

[0115] Such as Figure 15 As shown in (a), in the differential signal transmission line 2 according to the present embodiment, the pair of signal conductors 11 and 12 have a 90° bent portion 24 . If there is one such bent portion 24, a physical length difference of 2×d occurs between the pair of signal conductors 11 and 12, and a phase shift occurs in the differential signal after passing through the bent portion 24, which becomes a main cause of deterioration of reflection characteristics. .

[0116] Even with such a structure, by adjusting the values...

no. 3 Embodiment approach

[0121] Next, a differential signal transmission line 3 as a high-frequency differential signal transmission line according to a third embodiment of the present invention will be described with reference to the drawings. The same components as those of the differential signal transmission lines 1, 1', and 2 according to the first and second embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0122] Such as Figure 16 As shown, in the differential signal transmission line 3 according to the present embodiment, the pair of signal conductors 11 and 12 have a 90° bent portion 25 . In the bent portion 25 , the distance d1 between the pair of signal conductors 11 and 12 is narrower than the distance d between the pair of signal conductors 11 and 12 before and after the bent portion 25 (d1

[0123] With this configuration, the difference in conductor length between the first signal conductor 11 and the second signal conducto...

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PUM

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Abstract

The high-frequency differential signal transmission line of the present invention has: signal conductors (11, 12) for propagating differential signals; One end (11a, 12a) of the signal conductor (11, 12) is input with a differential signal, and the other end (11b, 12b) of the signal conductor (11, 12) is terminated through the terminal circuit (15, 16), and the differential circuit The differential input terminals (21a, 21b) of (21) carry out the receiving and receiving of differential signals, the signal conductor (11) is equal to the width (S) of the signal conductor (12), and the distance between the signal conductor (11) and the ground conductor (13) and The interval W between the signal conductor (12) and the ground conductor (14) is equal, and the interval d and interval W between the signal conductors (11, 12) are 0.1<(d / 2-W) / (d / 2+W)< 1.

Description

technical field [0001] The present invention relates to a differential signal transmission line used in a differential circuit having a pair of differential terminals for inputting and outputting a differential signal, formed on a substrate, and transmitting and receiving differential signals to and from the differential circuit. , A technology that improves the problem of degradation of reflection characteristics or generation of electromagnetic radiation interference caused by phase deviation of differential signals. Background technique [0002] In circuits that perform amplification processing or latch processing of high-frequency signals of several GHz or more, differential signals whose phases are opposite to each other are usually used, and in a differential circuit that amplifies or latches the differential signal, as a pair The differential terminal includes a differential input terminal and a differential output terminal. [0003] When forming a differential circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/00H01P3/02H03F3/45H03K19/0175
CPCH01P3/003H01P3/02H03F3/45071H03K19/017509
Inventor 平林文人神园隆司山口贵雄川田裕美
Owner ANRITSU CORP