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CSP bead with white wall fence and manufacturing method of CSP bead

A manufacturing method and white wall technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor heat dissipation, easy aging, short service life, etc., and achieve the effect of saving materials, convenient extraction, and simple process

Pending Publication Date: 2018-10-23
JIANGSU LUOHUA NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its heat dissipation performance is poor, it is easy to age, and its service life is short

Method used

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  • CSP bead with white wall fence and manufacturing method of CSP bead
  • CSP bead with white wall fence and manufacturing method of CSP bead
  • CSP bead with white wall fence and manufacturing method of CSP bead

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Experimental program
Comparison scheme
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Embodiment Construction

[0034] see Figure 3-7 , the manufacturing method of the CSP lamp bead that has white wall enclosure of the present invention, comprises:

[0035] A temporary carrier 1 is provided, and a copper plate 2 is mounted on the temporary carrier 1. The copper plate 2 is integrally cast and formed, and has a planar portion 21 and a plurality of recessed portions 20. The plurality of recessed portions 20 are arranged in an array cloth and respectively have a side wall 22 and a bottom wall 23, the bottom wall 23 is in contact with the temporary carrier 1;

[0036] The sidewalls 22 of the plurality of recesses 20 are respectively mechanically slotted to form openings 24, and the copper plate material partially removed from the openings 24 is at least partially pressed onto the temporary carrier 1 to form a connecting portion 25 And the electrode portion 26 used as a subsequent electrode, and the connecting portion 25 is connected to the copper plate 1;

[0037] Fix the LED chip on the ...

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PUM

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Abstract

The invention provides a CSP bead with a white wall fence and a manufacturing method of the CSP bead. An electrode part is formed directly via an integrated copper plate, the copper plate also has functions of a heat sink; the whole copper plate plays a whole support role, white walls are prevented from being peeled, and a packaging body is prevented from warping; and terminals can be led out conveniently, materials are saved and technology is simple.

Description

technical field [0001] The invention belongs to the field of LED packaging, and in particular relates to a CSP lamp bead with a white wall enclosure and a manufacturing method thereof. Background technique [0002] At present, the single-sided light-emitting CSP of the white wall enclosure is basically produced by prefabricating the white wall glue, grinding the white wall glue, and pressing the fluorescent glue. The production cycle of this process is long, the process is cumbersome, and additional investment in precision grinding equipment is required, which increases the production investment cost. Using this process to produce single-sided light-emitting CSP lamp beads does not have production capacity and cost advantages in mass production. [0003] see Figure 1-2 , on the pyrolysis film, make white wall enclosure 11 with specific shape, white wall enclosure 11 height is 0.2mm, then place flip chip 13 between white wall enclosure 11, next to white wall enclosure 11 F...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/62H01L33/64
CPCH01L33/48H01L33/54H01L33/62H01L33/641
Inventor 罗雪方薛水源瞿澄
Owner JIANGSU LUOHUA NEW MATERIAL