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Microphone module, manufacturing method of printed circuit board (PCB) and terminal

A technology for printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, and printed circuit assembly of electrical components, which can solve the problems of small space for sound guide channels, so as to solve the problem of too small space and avoid sound The effect of shrinking and distorting, expanding the space

Active Publication Date: 2018-10-26
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a microphone module, a method for manufacturing a printed circuit board PCB, and a terminal, so as to solve the problem that the space of the sound guide channel in the structure of the MIC sound output in the prior art is too small

Method used

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  • Microphone module, manufacturing method of printed circuit board (PCB) and terminal
  • Microphone module, manufacturing method of printed circuit board (PCB) and terminal
  • Microphone module, manufacturing method of printed circuit board (PCB) and terminal

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Aiming at the problem that the space of the sound guide channel is too small in the structure of the MIC sound output in the prior art, the present invention provides a microphone module, such as figure 1 shown, including:

[0033] The printed circuit board PCB1, and the microphone 2 and the sound guide structure 3 respectively connected to the PCB1;

[0034] Wherein, the surface of the microphone 2 connected to the PCB1 is provided ...

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Abstract

The invention provides a microphone module, a manufacturing method of a printed circuit board (PCB) and a terminal. The microphone module comprises the printed circuit board (PCB) and a microphone anda sound conducting structure which are connected with the PCB; a sound conducting hole is formed in the surface, connected with the PCB, of the microphone, the sound conducting hole, the PCB and thesound conducting structure are enclosed to form a cavity, and the cavity forms a sound conducting channel of the microphone module; and a groove is formed in the surface, for forming the sound conducting channel, of the PCB. According to the scheme, by forming the groove in the surface, for forming the sound conducting channel, of the PCB, the space of the sound conducting channel can be enlarged,and sound falling and distortion caused by the fact that the space of the sound conducting channel is too small due to the fact that sound cavity foam is extruded can be avoided; and the problem thatin the prior art, the space of the sound conducting channel in a sound outlet structure of the MIC is too small is well solved.

Description

technical field [0001] The present invention relates to the technical field of terminals, and in particular, to a microphone module, a method for manufacturing a printed circuit board (PCB), and a terminal. Background technique [0002] For mobile terminal products, thinner and lighter is the current product development direction. For the convenience of carrying, modern portable consumer electronic products are getting smaller and thinner, which can better reflect the ultimate product and improve the user experience. The internal design layout is also becoming more and more compact, and the space utilization of the internal circuit board (hereinafter referred to as PCB) directly affects the thickness of the mobile communication product. The device layout of the PCB is one of the key factors for making ultra-thin mobile communication products. During the PCB layout, the placement of some peripheral modules will be limited, such as the layout of the microphone (hereinafter re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H04R1/34H05K1/18H05K3/30H05K3/46
CPCH04R1/083H04R1/342H04R2499/11H05K1/18H05K3/30H05K3/4611
Inventor 徐职华
Owner VIVO MOBILE COMM CO LTD
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