Central processing unit chip heat dissipation device for blade server

Abstract

The invention relates to a central processing unit chip heat dissipation device for a blade server, and belongs to the technical field of integrated circuit chip heat dissipation. The heat dissipationdevice for the blade server comprises an evaporator, a heat pipe, a condenser and a heat dissipation air duct. Heat generated by a CPU chip is absorbed through the evaporator; a liquid working mediumin an evaporator cavity is rapidly vaporized into steam after being heated; and the heat pipe is used for transmitting working medium steam to the condenser for condensing, liquefying and heat releasing. Since the vapor and liquid phase change of the working medium is utilized to transfer heat, the thermal resistance is very small and the heat conduction capability is very high. The heat dissipation air duct is of a straight-through structure, the wind power is unidirectional and has no turbulence phenomenon, so that the condenser can quickly and fully dissipate heat, and the heat generated by the CPU chip can be rapidly discharged. The heat dissipation air duct is physically isolated from a circuit space of the blade server; the heat dissipation air flow only flows in the heat dissipation air duct, and does not enter the circuit space of the blade server, thus the problems that the existing heat dissipation device has a cascade heating effect, low heat dissipation efficiency, large fan noises and the like are solved.

Description

technical field [0001] The invention relates to a cooling device for a central processing unit chip used in a blade server, and belongs to the technical field of cooling for integrated circuit chips. Background technique [0002] A blade server refers to a server unit that can be plugged with multiple card types in a rack-mounted chassis of a standard height. It is a low-cost server platform that achieves high availability and high density. It is currently widely used in large data centers and high-performance Cluster construction. Due to the high-performance and high-integration design of the blade server, its advantage is that it minimizes the physical space occupied, but the disadvantage is that it greatly increases the power density and generates a lot of heat during operation. Therefore, the blade server The heat dissipation performance becomes the key factor to determine the stability of the system operation. [0003] The blade server is limited by the physical struc...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a kind of central processing unit chip cooling device for blade server, improve the structure of existing cooling device for blade server, utilize evaporator to absorb the heat that central processing unit chip produces, to solve Eliminates the cascading heating effect problem existing in existing blade server cooling devices

Images