A developing device, exposure and developing equipment, and a developing method

A technology of developing device and developing solution, which is applied in the processing of photosensitive materials, etc., and can solve the problem of large slope angle of photoresist holes

Active Publication Date: 2021-08-17
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a developing device, exposure and developing equipment, and a developing method, which are used to solve the problem that the slope angle of the photoresist hole is relatively large after the conventional developing device develops the photoresist on the substrate

Method used

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  • A developing device, exposure and developing equipment, and a developing method
  • A developing device, exposure and developing equipment, and a developing method
  • A developing device, exposure and developing equipment, and a developing method

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than in...

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Abstract

The invention discloses a developing device, exposure and developing equipment and a developing method, and relates to the technical field of developing devices, in order to solve the problem that the slope angle of the photoresist hole is relatively large after the existing developing device develops the photoresist on the substrate problem invented. The developing device includes a base platform and a developer nozzle, the base platform has a substrate placement surface, the developer solution nozzle is arranged opposite to the substrate placement surface, and a microwave emitting unit is arranged opposite to the substrate placement surface, The microwave emitting port of the microwave emitting unit is arranged towards the substrate placing surface, and along a direction parallel to the substrate placing surface, the microwave emitting unit is arranged in a staggered manner from the developer nozzle. The present invention can be used for development processing.

Description

technical field [0001] The invention relates to the technical field of developing devices, in particular to a developing device, exposure and developing equipment and a developing method. Background technique [0002] In the display panel industry, the circuit design is generally a superposition of 4 to 12 layers of patterns. In these multi-layer circuit designs, via holes are an essential part, which plays the role of connecting circuits and connecting the previous and the next; for example, in thin film transistors In the manufacturing process, in order to achieve overlapping between different film layers, dry etching is often used to form via holes (Via Hole) on the insulating film layer, such as S / D (source / drain) and Active layer Overlapping through ESL (Etch Stop Layer; Etch Stop Layer) holes, S / D and Gate (gate) through CNT (full name: Contact; Chinese interpretation: connection) holes for overlapping, ITO (Indium Tin Oxide) display The electrode and S / D are lapped t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/30
CPCG03F7/30
Inventor 刘宁闫梁臣周斌刘军程磊磊李广耀
Owner BOE TECH GRP CO LTD
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