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Cutting and polishing process of light guide film

A light guide film and cutting technology, which is applied in the field of cutting and polishing technology of light guide film, can solve the problems of complex processing technology of light guide film, limited cutting precision, and high processing difficulty, so as to avoid the adsorption of extremely small dust particles , Die-cut end face is smooth, and the edge is smooth

Active Publication Date: 2020-05-19
DONGGUAN GUANGZHI PHOTOELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when used in mobile phones, the requirements for the light guide film are relatively strict, which leads to the extremely complicated processing technology of the light guide film. It is very difficult to polish the microstructure on the four sides of the light guide film after cutting the light guide film, and the warpage value of the light guide film is difficult to control. Furthermore, the existing die-cutting machine and cutting and polishing process Cutting accuracy is limited, unable to meet the quality requirements of customers
[0004] At present, in the relevant technical field, there is still a lack of a better light guide film cutting and polishing process.

Method used

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  • Cutting and polishing process of light guide film
  • Cutting and polishing process of light guide film
  • Cutting and polishing process of light guide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Reference attached Figure 1-2 , a cutting and polishing process of light guide film, which is completed in the following steps: incoming material detection and measurement (S01)→leveling and cutting (SO2)→polishing (S03)→detection and cleaning (S04); Yes, the raw material (original film) of the light guide film has been formed with a cross target for marking positioning; the cutting machine used in this embodiment is a 26" optical film hydraulic alignment cutting machine, and its integrated CCD Positioning device and cutting with double peak knife;

[0041] The cutting and polishing process of the light guide film specifically includes the following

[0042] Step S01. Incoming material detection and measurement

[0043] The original film that meets the specifications is screened out by visual inspection, and the original film whose warpage value meets the set warpage specification is measured and screened by a thickness gauge. The set warpage specification is 0-5 mm;...

Embodiment 2

[0071] A kind of cutting and polishing process of light guide film specifically includes as follows

[0072] Step S01. Incoming material detection and measurement

[0073] The original film that meets the specifications is screened out by visual inspection, and the original film whose warpage value meets the set warpage specification is measured and screened by a thickness gauge. The set warpage specification is 0-5 mm; it should be noted that in In step S01, the visual inspection to screen out the original film that meets the specifications includes: visual inspection to screen out the original film without dots or wireless, that is, when the incoming material is inspected, as long as the visual inspection detects that there are dots or dots on the original film diaphragm The line is judged as the original film that cannot be used to prepare the light guide film;

[0074] Step S02. Leveling and cutting

[0075] Step S2-1. Tear off the protective film on the surface of the o...

Embodiment 3

[0093] A kind of cutting and polishing process of light guide film specifically includes as follows

[0094] Step S01. Incoming material detection and measurement

[0095] The original film that meets the specifications is screened out by visual inspection, and the original film whose warpage value meets the set warpage specification is measured and screened by a thickness gauge. The set warpage specification is 0-5 mm; it should be noted that in In step S01, the visual inspection to screen out the original film that meets the specifications includes: visual inspection to screen out the original film without dots or wireless, that is, when the incoming material is inspected, as long as the visual inspection detects that there are dots or dots on the original film diaphragm The line is judged as the original film that cannot be used to prepare the light guide film;

[0096] Step S02. Leveling and cutting

[0097] Step S2-1. Tear off the protective film on the surface of the o...

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Abstract

The invention discloses a cutting and polishing process of a light guide film. The cutting and polishing process of the light guide film comprises the steps of inspecting and measuring incoming materials, screening out original films conforming to the specification through visual inspection, utilizing a thickness gage for measuring and screening out original films with warping values conforming tothe preset warping specification, wherein the preset warping specification is 0 to 5mm; leveling and cutting so as to tear protection films on the surfaces of the original films with the preset width, and exposing cross-shaped targets; utilizing a leveler for baking and levelling the original films with the preset width; capturing the cross-shaped targets through a charge coupled device (CCD) positioning device, and using a cutting machine for para-position cutting the original films into single light guide film sheets with matched size; polishing and measuring the surface roughness of the single light guide film sheets; matching and setting working parameters of a polishing machine according to the measured surface roughness of the light guide film sheets, and polishing micro-integrationpolishing areas of the single light guide film sheets; dedusting and stacking the single light guide film sheets; levelling and polishing the stacked light guide films; detecting, cleaning, using a three-dimensional measuring instrument for measuring the light guide films, and carrying out dual-mode film covering on the secondarily dedusted light guide films.

Description

technical field [0001] The invention relates to the technical field of optical film processing, in particular to a cutting and polishing process for a light guiding film. Background technique [0002] In the high-precision die-cutting industry, the light guide film currently used in the mobile phone industry has the characteristics of ultra-thin, uniform luminescence, and changeable colors. The light film has an ultra-thin thickness but does not affect the feel. [0003] However, when used in mobile phones, the requirements for the light guide film are relatively strict, which leads to the extremely complicated processing technology of the light guide film. It is very difficult to polish the microstructure on the four sides of the light guide film after cutting the light guide film, and the warpage value of the light guide film is difficult to control. Furthermore, the existing die-cutting machine and cutting and polishing process The cutting accuracy is limited and cannot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 李海金关忠利
Owner DONGGUAN GUANGZHI PHOTOELECTRIC CO LTD