Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A coupon generation method and system for testing high-speed signal impedance

A high-speed signal generation system technology, applied in printed circuits, computer-designed circuits, electrical components, etc., can solve problems such as inaccuracy and tidiness, slow speed of artificially winding coupons, uneven coupon heights, etc., to improve efficiency and improve impedance Control quality, solve design time-consuming and inaccurate effects

Active Publication Date: 2021-05-25
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) It takes a long time. In large-scale PCB boards, especially large-scale server motherboards, there are many types of differential lines, so manual winding of coupons is slow and inefficient;
[0005] (2) Manual winding makes the coupon height uneven, not accurate enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A coupon generation method and system for testing high-speed signal impedance
  • A coupon generation method and system for testing high-speed signal impedance
  • A coupon generation method and system for testing high-speed signal impedance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0050] figure 1 It shows the implementation flowchart of the coupon generating method for testing high-speed signal impedance provided by the present invention, which specifically includes the following steps:

[0051] In step S101 , any differential signal line A among the differential signal lines requiring impedance control is generated according to the acquired basic parameters corresponding to the differential signal lines requiring impedance control.

[0052] In step S102, according to the generated differential signal line A, another differential signal line B of the differential signal line...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to the technical field of PCB design, and provides a method and system for generating coupons for testing high-speed signal impedance. The method includes: according to the obtained basic parameters corresponding to differential signal lines that require impedance control, generate impedance control. Any differential signal line A in the differential signal lines; according to the generated differential signal line A, generate another differential signal line B of the differential signal line that needs impedance control; according to the generated differential signal line A and The differential signal line B is converted into a differential line with line width attributes, so as to quickly and accurately draw coupons for impedance control testing, which greatly improves the efficiency of layout engineers designing coupons, solves the time-consuming and inaccurate defects of coupon design, and further improves Improve the quality of PCB high-speed line impedance control.

Description

technical field [0001] The invention belongs to the technical field of PCB design, in particular to a coupon generation method and system for testing high-speed signal impedance. Background technique [0002] At present, there are many kinds of PCB design software on the market. As the most widely used software in the industry, Cadence not only has powerful functions and a variety of related software as support, but also because it provides an open secondary development interface and relatively With a complete development language library, users can develop according to their own needs. Skill language is a high-level programming language based on C language and LISP language built into Cadence software. Skill language can be used not only as the simplest language tool, but also as a powerful programming language for developing any application. Skill can interact with the underlying system and provides a rich interface for accessing various tools of Cadence. Users can acces...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0002H05K3/0005
Inventor 王旭
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com