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Integrated fixture and welding method for 5G SFP package type optical transceiver module

A technology of optical transceiver module and welding method, which is applied in the direction of welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., to achieve the effect of reducing the influence of welding quality, low proficiency and operation technical requirements, and light weight

Active Publication Date: 2018-11-30
HENGTONG ROCKLEY TECHNOLOGY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a serious contradiction between the welding and quantity of 5G optical transceiver modules that meet these characteristics, especially the problem of large-scale processing has always been the bottleneck of high-speed, low-cost production capacity of 5G optical transceiver modules

Method used

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  • Integrated fixture and welding method for 5G SFP package type optical transceiver module

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Embodiment Construction

[0035] An integrated fixture for welding 5G SFP-packaged optical transceiver modules, see figure 1 : It includes a working base 1, a soft board welding part 2 and an optical device welding part 3 respectively arranged at the upper end positions of both ends of the working base 1 in the length direction, and the soft board welding part 2 is used for connecting the PCB circuit board and the PCB The flexible board is pre-fixed and pre-soldered, and the optical device welding part 3 welds the semi-finished device and optical device completed by the flexible board welding part 2 into a complete 5G SFP package optical transceiver module device.

[0036] The working base 1 is made of aluminum alloy, which can conduct the device and the ground;

[0037]The soft board welding part 2 specifically includes a welding operation table 4 and a welding combination fixture. The welding combination fixture specifically includes a pair of reversible pressure plates 5. The welding operation table...

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Abstract

The invention provides an integrated fixture for welding of a 5G SFP package type optical transceiver module. By means of the integrated fixture, the production qualified rate of the 5G SFP package type optical transceiver module is increased to 10% or over, the production cycle is shortened by 90% or over, welding operation is convenient, the welding performance is reliable, and the fixture is easy and convenient to machine. The integrated fixture comprises a working base table; a flexible plate welding part and an optical component welding part are arranged at the upper end positions of thetwo ends of the working base table in the length direction; the flexible plate welding part is used for prefixing and prewelding printed circuit boards (PCBs) and flexible PCBs; and the optical component welding part is used for welding semi-finished components and optical components completed by the flexible plate welding part into complete 5G SFP package type optical transceiver module components.

Description

technical field [0001] The invention relates to the technical field of optical device manufacturing, specifically an integrated jig for welding 5G SFP-packaged optical transceiver modules, and the invention also provides a welding method using the jig for welding. Background technique [0002] As far as the current 5G planning is concerned, the rate will reach 10-100 times that of the 4G network. At this rate, the base station must use optical modules to achieve service functions, so the demand for 5G optical modules will far exceed that of 4G. The demand for optical modules. The core components in 5G base stations and 5G transmission equipment are 8G and 100G SFP package type optical modules. According to the data of the Ministry of Industry and Information Technology, the total global 5G optical module market has reached 200 billion US dollars. The main packaging form of common 5G optical transceiver modules is SFP. This packaging type covers multiple scenarios from mult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K37/04
CPCB23K3/087
Inventor 赵关宝施伟明徐虎孙权吴贝佳
Owner HENGTONG ROCKLEY TECHNOLOGY CO LTD
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