Treatment technology after production of ultrathin copper foil

A treatment process, ultra-thin copper foil technology, applied in metal material coating process, superimposed layer plating, coating, etc., can solve the problems of low bonding strength and easy falling off of copper foil and substrate, and eliminate Effect of delamination of treatment layer and wool foil, increase of surface area, and improvement of bonding strength

Inactive Publication Date: 2018-12-04
安徽华创新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Aiming at the deficiencies of the prior art, the present invention provides a treatment process after the preparation of ultra-thin copper foil, which solves the problem that if the pretreated copper foil is directly laminated with an insulating resin substrate, the bonding strength between the copper foil and the substrate will not be sufficient. High, easy to fall off problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A treatment process after the preparation of ultra-thin copper foil, comprising the following steps: copper foil curing treatment → copper foil rough surface galvanizing treatment → copper foil surface passivation treatment → silane coupling agent treatment → copper foil drying treatment → copper foil treatment foil slitting;

[0028] S1. Copper foil curing treatment: Deposit a layer of dense metallic copper in the nodular particle gaps of the roughened layer to increase the contact surface between the roughened layer and the wool foil substrate to reduce the surface roughness of the roughened layer. After the rough surface of the upper copper foil is roughened, the surface of the foil is uneven and fluctuates greatly, but the surface of the copper foil is relatively flat after the curing treatment. The contact area is small, which leads to the improvement of the bonding strength between the treatment layer and the insulating substrate material, and fundamentally elimin...

Embodiment 2

[0035] A treatment process after the preparation of ultra-thin copper foil, comprising the following steps: copper foil curing treatment → copper foil rough surface galvanizing treatment → copper foil surface passivation treatment → silane coupling agent treatment → copper foil drying treatment → copper foil treatment foil slitting;

[0036] S1. Copper foil curing treatment: Deposit a layer of dense metallic copper in the nodular particle gaps of the roughened layer to increase the contact surface between the roughened layer and the wool foil substrate to reduce the surface roughness of the roughened layer. After the rough surface of the upper copper foil is roughened, the surface of the foil is uneven and fluctuates greatly, but the surface of the copper foil is relatively flat after the curing treatment. The contact area is small, which leads to the improvement of the bonding strength between the treatment layer and the insulating substrate material, and fundamentally elimin...

Embodiment 3

[0043] A treatment process after the preparation of ultra-thin copper foil, comprising the following steps: copper foil curing treatment → copper foil rough surface galvanizing treatment → copper foil surface passivation treatment → silane coupling agent treatment → copper foil drying treatment → copper foil treatment foil slitting;

[0044] S1. Copper foil curing treatment: Deposit a layer of dense metallic copper in the nodular particle gaps of the roughened layer to increase the contact surface between the roughened layer and the wool foil substrate to reduce the surface roughness of the roughened layer. After the rough surface of the upper copper foil is roughened, the surface of the foil is uneven and fluctuates greatly, but the surface of the copper foil is relatively flat after the curing treatment. The contact area is small, which leads to the improvement of the bonding strength between the treatment layer and the insulating substrate material, and fundamentally elimin...

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Abstract

The invention discloses a treatment technology after the production of an ultrathin copper foil, and relates to the technical field of production of the copper foils. The treatment technology after the production of the ultrathin copper foil comprises the following steps: copper foil curing treatment, copper foil rough surface galvanizing treatment, copper foil surface passivation treatment, silane coupling agent coating, copper foil drying treatment and copper foil cutting treatment, wherein the copper foil curing treatment is characterized in that a layer of dense metal copper is deposited in tuberculate space gaps of the rough layer to increase the contact surface of the roughen layer and a rough foil substrate in order to reduce the surface roughness of the rough layer. A layer of thetuberculate copper particles is electropalted on the rough surface of the copper foil, so the surface area of the rough surface of the copper foil is increased, and the copper foil is mechanically fastened an insulating resin substrate material; and the curing treatment reduces the roughness, and the increase of the contact area between the rough layer and the rough foil increases the bonding strength between the treated layer and the insulating substrate material, so the layering phenomenon of the treated layer and the rough foil is fundamentally eliminated.

Description

technical field [0001] The invention relates to the technical field of copper foil preparation, in particular to a treatment process after preparation of ultra-thin copper foil. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. [0003] Copper foil has low surface oxygen characteristics, can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. Mainly used in electromagnetic shielding and antistatic, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, it has excellent conductivity and provides the effect of electromagnetic shielding. It can be divided into: self-adhesive copper foil, double-lea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C23C22/73
CPCC23C22/73C23C28/025C23C2222/20
Inventor 殷勇余超
Owner 安徽华创新材料股份有限公司
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