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An adjustment device and a washing machine

A technology for adjusting devices and cleaning machines, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., and can solve problems such as fixing silicon wafers

Active Publication Date: 2020-12-04
ZING SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an adjustment device and a cleaning machine to solve the problem that the gap between the existing silicon wafers is always fixed

Method used

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  • An adjustment device and a washing machine
  • An adjustment device and a washing machine
  • An adjustment device and a washing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] figure 1 It is a schematic diagram of the structure of the adjusting device in an embodiment of the present invention before adjusting the gap between the silicon wafers. refer to figure 1 , an adjusting device for adjusting the gap between silicon wafers, comprising at least two carrying platforms 10 and a rotating member 30 . Each of the carrying platforms 10 is used to carry a single silicon wafer 20 . All the carrying platforms 10 are distributed along the axial direction of the rotating member 30 , and the rotating member 30 is used to drive all the carrying stages 10 to move in a direction parallel to the axial direction of the rotating member 30 . Since each carrying platform 10 can be used to carry a silicon wafer 20, and all the carrying platforms 10 are distributed along the axial direction of the rotating member 30, the rotating member 30 can drive all the carrying stages 10 along a direction parallel to The axial direction of the rotating member 30 moves,...

Embodiment 2

[0051] In this embodiment, the rotating member drives the carrying platform to move through a screw transmission mechanism. Specifically, at least two threads are provided on the outer peripheral surface of the rotating member, and each thread is threadedly connected with each of the carrying platforms. In this way, when the rotating member rotates, the rotating member drives the carrying platform screwed with the rotating member to move along the axial direction of the rotating member, so that the carrying platform can move in the axial direction of the rotating member. The gap adjustment, that is, the gap adjustment between the silicon wafer and the silicon wafer is realized. In this case, the screw connection relationship between the rotating part and the carrying platform limits the freedom of movement of the carrying platform along the radial direction of the rotating part, so that the carrying platform can only move along the axial direction of the rotating part move. ...

Embodiment 3

[0058] This embodiment provides a cleaning machine for cleaning silicon wafers. The cleaning machine includes the adjustment device in the first embodiment above, or the adjustment device in the second embodiment above. The cleaning machine in this embodiment can adjust the gap between the silicon wafers to less than 10mm due to the adjustment device, so that the overall volume of the silicon wafers is reduced, thereby saving the consumption of pure water and chemicals for cleaning the silicon wafers , reduce the cleaning cost, and at the same time shorten the flow path of chemicals, so that the cycle efficiency of chemicals is increased and the cleaning efficiency is high.

[0059] In this embodiment, the cleaning machine includes an overturning device for adjusting the placement direction of the silicon wafer, and the adjusting device is fixedly arranged on the overturning device. It should be understood that the adjusting device can also be arranged on other devices of the...

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PUM

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Abstract

The invention provides an adjusting device used for adjusting gaps between silicon chips and a cleaning machine equipped with the adjusting device and used for cleaning the silicon chips. The adjusting device comprises at least two supporting platforms and a rotating member, each of the supporting platforms is used for supporting one single silicon chip, all the supporting platforms are distributed along an axial direction of the rotating member, and the rotating member is used for driving all the supporting platforms to move along the axial direction of the rotating member. The adjusting device disclosed in the invention can be used for adjusting sizes of gaps between the silicon chips.

Description

technical field [0001] The invention relates to the technical field of silicon wafer manufacturing, in particular to an adjustment device for adjusting the gap between silicon wafers, and a cleaning machine for cleaning silicon wafers provided with the adjustment device. Background technique [0002] In order to facilitate the circulation of silicon wafers between various production processes and the transportation of finished products, silicon wafers are mostly stored in Front Opening Unified Pods (FOUPs) or Front Opening Shipping Boxes (FOSBs). When silicon wafers are placed in the aforementioned two types of boxes, the gap between silicon wafers is fixed, for example, the gap is set to 10mm in the industry. Correspondingly, in some processes that process a group of silicon wafers at the same time, such as the silicon wafer cleaning process or the silicon wafer drying process, in order to improve the silicon wafer from FOUP or FOSB to the corresponding process, and then to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67092
Inventor 徐亚志
Owner ZING SEMICON CORP