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Ultra small size chip cutting technology

A cutting process and chip technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of poor control of cutting vibration conduction, cracking on the back of the product, etc., and achieve the effect of improving stability

Inactive Publication Date: 2018-12-04
NINGBO CHIPEX SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the technical defect that the traditional cutting method has poor control over the cutting vibration conduction, which easily causes the back of the product to crack, and provides an ultra-small chip cutting process

Method used

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Experimental program
Comparison scheme
Effect test

specific Embodiment

[0035] An ultra-small chip cutting process, comprising the steps of:

[0036] (1) Fix the wafer with the dicing film attached on the back on the ring;

[0037] (2) putting the wafer and sheet ring described in step (1) into an oven for baking;

[0038] (3) Put the baked wafer described in step (2) into a cutting machine, select a program to cut, wherein the cutting sequence is to cut along the short side direction of the chip first, and then cut along the long side direction of the chip, That is CH1CH2.

[0039] In the step (1), the wafer is a test piece or a customer piece, the test piece includes a semiconductor layer and a packaging layer, and the customer piece includes a semiconductor layer, a circuit layer and a packaging layer.

[0040] The semiconductor layer is a silicon wafer layer, and the thickness of the wafer is 125 μm.

[0041] In the step (1), the scribing film is a non-UV blue film, and the non-UV blue film is V-8AR of Nitto Denko Co., Ltd., with a film thi...

Embodiment 2

[0051] Embodiment 2 adopts the cutting sequence of the short side first and then the long side, and the CH1 surface (short side) adopts a feed speed of 15mm / s. Although the overall cutting time will increase by about 10%, the stability is better than the traditional long side first. The cutting process of the rear short side has been greatly improved.

[0052] The effect of adopting the process described in embodiment 2 to cut the customer sheet is shown in Figure 1-7 :

[0053] figure 1 Cut the effect picture for the upper left 1 / 4 edge of the back of the customer's film, from figure 1 It can be seen that the cutting effect is good, and there is no edge chipping after separation, and the cutting effect is OK;

[0054] Figure 2~3 Cut the effect picture for the lower left 1 / 4 edge of the back of the customer's film, from Figure 2~3It can be seen that the cutting effect is good, and there is no edge collapse after one cut; compared with the area on the other side that is...

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Abstract

The invention discloses an ultra small size chip cutting technology. The technology includes steps of (1) fixing a wafer bonded with a scribing film on the back face on a chip ring; (2) putting the wafer and the chip ring into an oven for roasting; (3) putting the wafer subjected to roasting into a cutting machine and selecting a program for cutting, wherein the cutting sequence is first cutting along the short direction of the chip and then cutting along the long edge direction of the chip. According to the invention, the cutting technology of cutting along the short edge direction first andcutting along the long edge direction then is innovatively adopted, at the same time, a blue film roasting parameter, a cutting parameter and a scribing knife of a Z2 main shaft are adjusted so as tobreak a conventional cutting mode. The invention provides the ultra small size chip cutting technology. According to the invention, the chip yield rate of both of a testing chip and a client chip reach over 99.5% and chip cutting stability of different parts in one wafer is also improved greatly.

Description

technical field [0001] The invention relates to the field of chip cutting, in particular to an ultra-small chip cutting process. Background technique [0002] Under normal circumstances, the chip cutting rule is to cut the long side first and then cut the short side. This is mainly for a longer distance when the chip is separated and to ensure the stability of the separation. At present, the cutting of small-size chip products is unstable mainly because the long side is cut first and then the short side is cut. The short side is too narrow, and the backside cracks due to vibration transmission during cutting. As the size of the chip becomes smaller and smaller, the ability of the traditional dicing process to control the cracking of the backside decreases rapidly, resulting in a rapid increase in the abnormality rate, which seriously affects the production efficiency and product quality of the product. Therefore, it is necessary to improve the prior art. Contents of the i...

Claims

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Application Information

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IPC IPC(8): H01L21/78
CPCH01L21/78
Inventor 汪洋于政方梁洪罗立辉
Owner NINGBO CHIPEX SEMICON
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